Hostname: page-component-76fb5796d-2lccl Total loading time: 0 Render date: 2024-04-27T02:47:01.928Z Has data issue: false hasContentIssue false
  • English
  • Français

Open-hardware, High-vacuum Storage for TEM Holders Remedies and Quantifies Hydrocarbon Contamination

Published online by Cambridge University Press:  30 July 2020

Yin Min Goh ,
Jonathan Schwartz ,
Tao Ma ,
Bobby Kerns  and
Robert Hovden
Yin Min Goh
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Jonathan Schwartz
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Tao Ma
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Bobby Kerns
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States
Robert Hovden
Affiliation:
University of Michigan, Ann Arbor, Michigan, United States

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Pushing the Limits of Detection in Quantitative (S)TEM Imaging, EELS, and EDX
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 3120 - 3123
Check for updates
Copyright
Copyright © Microscopy Society of America 2020

References

Love, G., et al. ., Scanning 4 , 32–39 (1981).10.1002/sca.4950040105CrossRefGoogle Scholar
Stewart, R.L., Phys. Rev. 45, 488–490 (1934).10.1103/PhysRev.45.488CrossRefGoogle Scholar
Conru, H.W., Laberge, P.C., J. Phys. E: Sci. Instrum. 8 (1975).10.1088/0022-3735/8/2/021CrossRefGoogle Scholar
Hillier, J., Journal of Applied Physics 19, 226–230 (1948).10.1063/1.1715049CrossRefGoogle Scholar
de Jonge, N., et al. ., Nature Review Materials 14 (2019).Google Scholar
Soong, C., et al. ., Microscopy Today 20, 44–48 (2012).10.1017/S1551929512000752CrossRefGoogle Scholar
Griffiths, A.J.V., Walther, T., J. Phys.: Conf. Ser. 241 012017 (2010).Google Scholar
Leuthner, G.T., et al. ., Ultramicroscopy 203, 76–81 (2019).10.1016/j.ultramic.2019.02.002CrossRefGoogle Scholar
Bance, U.R., et al. ., Vacuum. 28 (1978).10.1016/S0042-207X(78)80029-3CrossRefGoogle Scholar
Conru, H.W., Laberge, P.C., J. Phys. E: Sci. Instrum. 8 (1975).10.1088/0022-3735/8/2/021CrossRefGoogle Scholar
Ennos, A.E., Journal of Applied Physics. 4, 101–106 (1953).Google Scholar
Williams, D.B., Carter, C.B., Transmission Electron Microscopy: A Textbook for Materials Science, Springer-Verlag (2009).10.1007/978-0-387-76501-3CrossRefGoogle Scholar
Jousten, K., Proceedings of Vacuum Technology, CERN Accelerator School (1999).Google Scholar
Jousten, K., Vacuum 49 359–360 (1998).10.1016/S0042-207X(98)00002-5CrossRefGoogle Scholar
Grinham, R., Chew, A., Appl. Sci. Converg. Technol. 26, 95–109 (2017).10.5757/ASCT.2017.26.5.95CrossRefGoogle Scholar
Hettler, S., et al. ., Micron. 96, 38–47 (2017).10.1016/j.micron.2017.02.002CrossRefGoogle Scholar
Dayton, B., Trans. 8th AVS. VAC. Symp. 42 (1961).Google Scholar
McGilvery, C.M., et al. ., Micron. 43, 450–455 (2012).10.1016/j.micron.2011.10.026CrossRefGoogle Scholar
Griffiths, A.J.V., Walther, T., J. Phys.: Conf. Ser. 241, 012017 (2010).Google Scholar
Acknowledgements: Authors recognize support from the Michigan Center for Materials Characterization (MC2) and inspiration from other facilities with custom, in-house TEM manifolds—including Cornell University and McMaster University.Google Scholar