Hostname: page-component-848d4c4894-nmvwc Total loading time: 0 Render date: 2024-06-27T20:47:38.414Z Has data issue: false hasContentIssue false
  • English
  • Français

Observation of Rectifying and Ohmic Grain Boundaries in Polycrystalline BaTiO3 Capacitors with STEM EBIC

Published online by Cambridge University Press:  30 July 2020

William Hubbard ,
Zachary Lingley ,
Miles Brodie  and
Brendan Foran
William Hubbard
Affiliation:
The Aerospace Corporation, El Segundo, California, United States
Zachary Lingley
Affiliation:
The Aerospace Corporation, El Segundo, California, United States
Miles Brodie
Affiliation:
The Aerospace Corporation, El Segundo, California, United States
Brendan Foran
Affiliation:
The Aerospace Corporation, El Segundo, California, United States

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Advances in Electron Microscopy to Characterize Materials Embedded in Devices
Information
Microscopy and Microanalysis , Volume 26 , Supplement S2 , August 2020 , pp. 374 - 375
Check for updates
Copyright
Copyright © Microscopy Society of America 2020

References

Everhart, TE, Wells, OC, and Matta, RK, Proceedings of the IEEE, 52 (1964). p. 1642–164710.1109/PROC.1964.3460CrossRefGoogle Scholar
Leamy, HJ, Journal of Applied Physics, 53 (1982), p. R51–R80.10.1063/1.331667CrossRefGoogle Scholar
Hubbard, WA, et al. , Physical Review Applied, 10 (2018), p. 044066.10.1103/PhysRevApplied.10.044066CrossRefGoogle Scholar
Hubbard, WA, et al. , Applied Physics Letters, 115 (2019), p. 133502.10.1063/1.5117055CrossRefGoogle Scholar
Mecklenburg, M, et al. , Ultramicroscopy, 207 (2019), p. 112852.10.1016/j.ultramic.2019.112852CrossRefGoogle Scholar
Mecklenburg, M, et al. , Microscopy and Microanalysis, 19 (2013), p. 458–459.10.1017/S1431927613004285CrossRefGoogle Scholar
Smith, CA et al. , IEEE Transactions on Electron Devices, 33 (1986), p. 282–285.10.1109/T-ED.1986.22479CrossRefGoogle Scholar