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The novel feature based inspection technique that can detect defects that can affect the deterioration of the electrical properties of semiconductor devices

Published online by Cambridge University Press:  30 July 2021

Sungyoon Ryu ,
Younghoon Sohn  and
Yusin Yang
Sungyoon Ryu
Affiliation:
Samsung electronics, Republic of Korea
Younghoon Sohn
Affiliation:
Samsung electronics, Seoul-t'ukpyolsi, Republic of Korea
Yusin Yang
Affiliation:
Samsung electronics, Seoul-t'ukpyolsi, Republic of Korea

Abstract

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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 792 - 793
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Tobin, K.W. submission for: Sankaran, V., Weber, C.M., Tobin, K.W. “Inspection in Semiconductor Manufacturing”, Webster's Encyclopedia of Electrical and Electronic Engineering, vol. 10, pp. 242-262, Wiley & Sons, NY, NY, 1999.Google Scholar
Blauberg, A., et al. , “Understanding process and design systematics: case study on monitoring strategy and understanding root cause of fin defectively, ASMC, 2017CrossRefGoogle Scholar