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Microstructural Evaluation of Degradation Mechanisms in Thermally Treated TaSiN Diffusion Barriers for Cu Interconnects

Published online by Cambridge University Press:  01 August 2004

Hans-Juergen Engelmann ,
RenË Huebner ,
Michael Hecker ,
Norbert Mattern ,
Christian Wenzel ,
Ehrenfried Zschech  and
Klaus Wetzig
Hans-Juergen Engelmann
Affiliation:
AMD Saxony , Dresden, Germany
RenË Huebner
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Michael Hecker
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Norbert Mattern
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
Christian Wenzel
Affiliation:
Dresden University of Technology, Dresden, Germany
Ehrenfried Zschech
Affiliation:
AMD Saxony , Dresden, Germany
Klaus Wetzig
Affiliation:
Leibnitz Institute for Solid State and Materials Research, Dresden, Germany
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Extract

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.

Type
Research Article
Information
Microscopy and Microanalysis , Volume 10 , Issue S02 , August 2004 , pp. 616 - 617
Copyright
© 2004 Microscopy Society of America

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