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In-Situ TEM Investigation of the Solid/Liquid Interface in Al-Si Alloys

Published online by Cambridge University Press:  02 July 2020

Garrett A. Storaska  and
James M. Howe
Garrett A. Storaska
Affiliation:
Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia22903, USA
James M. Howe
Affiliation:
Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia22903, USA
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Extract

The solid/liquid interface is a junction between two condensed phases with completely different atomic arrangements. At the interface between the periodically ordered solid and the amorphous liquid, the atoms adopt a structure that minimizes the excess energy due to the abrupt change between the surrounding phases. Faceted and diffuse interfaces describe two extremes in morphology of a solid/liquid interface. In a faceted interface, the change from solid to liquid occurs over one atomic layer, however periodic order extends into the first few liquid layers adjacent to the crystalline solid, as predicted by numerous models.1 The faceted interface advances by nucleation and growth of ledges on the interface. A diffuse interface has a structure in which the change from solid to liquid occurs over several atomic layers. This interface contains many ledges to which liquid atoms may attach continuously as the interface advances.

Type
Surfaces and Interfaces
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 1068 - 1069
Copyright
Copyright © Microscopy Society of America

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References

References:

1)Howe, J. M., 1997, Interfaces in Materials (John Wiley & Sons, Inc.) pp. 224–236.Google Scholar
2)Murr, L. E., 1975, Interfacial Phenomena in Metals and Alloys (Addison-Wesley Publishing Co.) p. 34.Google Scholar
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