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Imaging Soft and Hard Dielectric Breakdown in Resistive Switching

Published online by Cambridge University Press:  30 July 2021

B. C. Regan ,
Jared Lodico ,
Ho Leung Chan ,
Matthew Mecklenburg  and
William Hubbard
B. C. Regan
Affiliation:
Department of Physics and Astronomy, University of California, Los Angeles, California90095, United States, United States
Jared Lodico
Affiliation:
Department of Physics and Astronomy, University of California, Los Angeles, California90095, United States, United States
Ho Leung Chan
Affiliation:
University of California, Los Angeles, Los Angeles, California, United States
Matthew Mecklenburg
Affiliation:
Core Center of Excellence in Nano Imaging (CNI), University of Southern California, Los Angeles, California90089, United States, United States
William Hubbard
Affiliation:
NanoElectronic Imaging, Inc., Los Angeles, California, United States

Abstract

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Type
Advanced Imaging and Spectroscopy for Nanoscale Materials Characterization
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 2354 - 2355
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Palumbo, F et al. , Advanced Functional Materials 30 (2019) 1900657.CrossRefGoogle Scholar
Hubbard, WA et al. , Nano Letters 15 (2015) p. 3983–3987.Google Scholar
Hubbard, WA et al. , Physical Review Applied 10 (2018), p. 044066.CrossRefGoogle Scholar
Hubbard, WA et al. , Applied Physics Letters 115 (2019), p. 133502.CrossRefGoogle Scholar
This work was supported by the Semiconductor Research Corporation, by National Science Foundation (NSF) award DMR-2004897, and by NSF STC award DMR-1548924.Google Scholar