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FIB/TEM Sample Preparation using a Wafer Dicing Saw

Published online by Cambridge University Press:  02 July 2020

Lancy Tsung ,
Adolfo Anciso ,
Bruce Davidson ,
Robert Turner ,
Tareq Alqaq  and
Alois Skloss
Lancy Tsung
Affiliation:
Texas Instruments, Semiconductor Group, Kilby Physical Analysis Lab, Dallas, Texas, 75243
Adolfo Anciso
Affiliation:
Texas Instruments, Semiconductor Group, Kilby Physical Analysis Lab, Dallas, Texas, 75243
Bruce Davidson
Affiliation:
Texas Instruments, Semiconductor Group, Kilby Physical Analysis Lab, Dallas, Texas, 75243
Robert Turner
Affiliation:
Texas Instruments, Semiconductor Group, Kilby Physical Analysis Lab, Dallas, Texas, 75243
Tareq Alqaq
Affiliation:
Texas Instruments, Semiconductor Group, Kilby Physical Analysis Lab, Dallas, Texas, 75243
Alois Skloss
Affiliation:
Texas Instruments, Semiconductor Group, Kilby Physical Analysis Lab, Dallas, Texas, 75243
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Extract

As device features shrink below sub-0.2 micron and the time from development to market reduces, the demand for using focused ion beam (FIB) to prepare TEM samples has increased tremendously over the last two years in semiconductor industry. There are many ways to prepare a TEM sample prior to the FIB one of them involves with a use of dicing saw. In our lab, about 80% of the samples were prepared using the dicing saw technique. Average time to cut out one sample is less than 20 minutes.

The dicing saw we used is a Disco model DAD321 equipped with a 250X optical and ccd camera viewing monitor system. To minimize chipping, a 200 um-thick diamond resin composite blade is used. A spindle rotation speed at 30,000 rpm and a stage moving speed at 100 mm/s is set for minimizing blade ware and sample chipping. The parameters for each cut are pre-programmed, so there is no setup required.

Type
Specimen Preparation Techniques for Materials Sciences
Information
Microscopy and Microanalysis , Volume 6 , Issue S2: Proceedings: Microscopy & Microanalysis 2000, Microscopy Society of America 58th Annual Meeting, Microbeam Analysis Society 34th Annual Meeting, Microscopical Society of Canada/Societe de Microscopie de Canada 27th Annual Meeting, Philadelphia, Pennsylvania August 13-17, 2000 , August 2000 , pp. 500 - 501
Copyright
Copyright © Microscopy Society of America

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References

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