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FIB-assisted TEM Sample Preparation Refinement Using TRIM Simulations

Published online by Cambridge University Press:  23 September 2015

Ashley Sutor  and
Bryan Gauntt
Ashley Sutor
Affiliation:
Intel Corporation, CQN, Hillsboro, USA
Bryan Gauntt
Affiliation:
Intel Corporation, CQN, Hillsboro, USA

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 21 , Supplement S3: Proceedings of Microscopy & Microanalysis 2015 , August 2015 , pp. 1989 - 1990
Copyright
Copyright © Microscopy Society of America 2015 

References

References:

[1] Mayer, Joachim, Lucille, A. Giannuzzi, Takeo, Kamino & Joseph, Michael, "TEM Sample Preparation and FIB-Induced Damage." MRS Bulletin 32(05) (2007). p 400–407.Google Scholar
[2] Kato, N. I., "Reducing Focused Ion Beam Damage to Transmission Electron Microscopy Samples.". Journal of Electron Microscopy 53(5) (2004). p 451–458.Google Scholar
[3] Xiao, Hong in "Introduction to Semiconductor Manufacturing Technology". 2nd ed. 2012 (SPIE, Bellingham) p.5-6.Google Scholar
[4] Ziegler, J. F. The Stopping Range for Ions in Matter (SRIM) Software package, 2013. <http://www.srim.org/>..>Google Scholar
[5] Ziegler, J. F., Biersack, J. P. & Matthias, D. Ziegler in "SRIM: The Stopping and Range of Ions in Matter". 2008. (SRIM Co, Chester).Google Scholar
[6] Ghandhi, Sorab Khushro, "VLSI Fabrication Principles: Silicon and Gallium Arsenide" (1983) Whiley, New York), p. 372.Google Scholar