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Developing High Resolution and High Precision Strain Mapping Methodologies for Materials Research and Semiconductor Technology

Published online by Cambridge University Press:  01 August 2018

Jian-Min Zuo ,
Renliang Yuan ,
Honggyu Kim  and
Jiong Zhang
Jian-Min Zuo
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
Renliang Yuan
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
Honggyu Kim
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
Jiong Zhang
Affiliation:
Intel Corp., Hillsboro, Oregon, USA

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 24 , Supplement S1: Proceedings of Microscopy & Microanalysis 2018 , August 2018 , pp. 966 - 967
Copyright
© Microscopy Society of America 2018 

References

[1] Welser, J., Hoyt, J. Gibbons, J. Electron Device Letters. IEEE 15(3 1994) p. 100.Google Scholar
[2] Zuo, J.M. Spence, J.C.H. "Advanced Transmission Electron Microscopy: Imaging and Diffraction in Nanoscience." 2017 Springer.Google Scholar
[3] Zuo, J.M., et al, Ultramicroscopy 136 2014) p. 50.Google Scholar
[4] Beche, A., et al, Ultramicroscopy131 2013) p. 10.Google Scholar
[5] Kim, K.H., et al, Micron 71 2015) p. 39.Google Scholar
[6] Honggyu Kim, , et al, IUCrJ 5(1 2018) p. 67.Google Scholar
[7] Honggyu Kim, , et al, Journal of Applied Physics 123(16 2017) p. 161521.Google Scholar
[8] This work is supported by a grant from Semiconductor Research Corporation and by U.S. Army Research Office (Grant No. Army W911NF-10-1-0524 and monitored by Dr. William Clark) through the MURI program..Google Scholar