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Creep Deformation Microstructures in DS Nb-Hf-Ti-Si In-Situ Composites
Published online by Cambridge University Press: 02 July 2020
Extract
Directionally solidified (DS) in-situ composites based on (Nb) and (Nb) silicides, such as Nb5Si3 and Nb3Si, are presently under investigation as high-temperature structural materials [1, 2]. Alloying additions of elements such as Hf, Ti and Mo to these silicides are also being explored. The present paper describes the microstructure of a DS Nb-silicide based composite before and after creep deformation.
Alloys were prepared from high purity elements (>99.9%) using induction levitation melting in a segmented water-cooled copper crucible. The alloys were directionally solidified using the Czochralski method [2]. Creep tests were conducted at 1200°C to 50% deformation. Characterization was performed using scanning electron microscopy, electron microprobe analysis (EMPA), and electron backscatter diffraction pattern analysis (EBSP).
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- Electron diffraction in the SEM: automated EBSP and its application
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- Copyright © Microscopy Society of America