Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-06-17T17:23:41.101Z Has data issue: false hasContentIssue false

Chain Structure Defect Location by Focused Ion Beam Passive Voltage Contrast

Published online by Cambridge University Press:  02 July 2020

B.B. Rossie
Affiliation:
Lucent Technologies, 9333 S. John Young Pkwy., Orlando, FL, 32819
T.L. Shofner
Affiliation:
Lucent Technologies, 9333 S. John Young Pkwy., Orlando, FL, 32819
S.R. Brown
Affiliation:
Lucent Technologies, 9333 S. John Young Pkwy., Orlando, FL, 32819
D.M. Shuttleworth
Affiliation:
Lucent Technologies, 9333 S. John Young Pkwy., Orlando, FL, 32819
D. Nguyen
Affiliation:
Bartech, 9333 S. John Young Pkwy., Orlando, FL, 32819
Get access

Extract

Defects present in microelectronic devices are often present in test structures as well. This makes test structures useful in identifying defect mechanisms. Chain patterns consists of thousands of contacts and plugs in series. The presence of an open contact in a chain can be detected by a loss of electrical continuity. The specific site of an open contact is difficult to locate for further analysis.

The application of the focused ion beam (FIB) for passive voltage contrast (PVC) provides an effective method for contact defect location. Once the defect is located the FIB facilitates efficient site-specific specimen preparation for scanning electron microscopy (SEM), transmission electron microscopy (TEM) or Auger analysis.

The FIB is capable of PVC analysis by distinguishing electrically isolated conductors from grounded conductors. Isolated conductors charge as a result of ion beam interaction. Once charged, the quantity of secondary electrons available for detection is greatly reduced.

Type
Applications and Developments of Focused Ion Beams
Copyright
Copyright © Microscopy Society of America

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

References:

1.Giewont, K., et al., J. Vac. Sci. Tech. B 15-4 (1997) 916.CrossRefGoogle Scholar
2.Stevie, F. A., et al., Surf, and Inter. Anal. 23 (1995) 61.CrossRefGoogle Scholar
3.Campbell, A. and Soden, J.. Proceedings for the 24th ISTFA, Dallas, TX (1998) 129.Google Scholar