Hostname: page-component-7479d7b7d-8zxtt Total loading time: 0 Render date: 2024-07-08T13:51:51.212Z Has data issue: false hasContentIssue false
  • English
  • Français

Application of Confocal Laser Imaging Microscopy and Raman Spectroscopy to Particle Characterization in Semiconductor Industry

Published online by Cambridge University Press:  02 July 2020

Giuseppina Conti  and
Yuri Uritsky
Giuseppina Conti
Affiliation:
Defect and Thin Film Characterization Laboratory; Applied Materials, Inc., M/S 0102, 3050 Bowers Avenue, Santa Clara, CA, 95054
Yuri Uritsky
Affiliation:
Defect and Thin Film Characterization Laboratory; Applied Materials, Inc., M/S 0102, 3050 Bowers Avenue, Santa Clara, CA, 95054
Get access

Abstract

The analytical needs in semiconductor technology have developed according to the increasing demands imposed by size and complexity. Early optical visualization, localization and counting of ever-smaller particles extended almost immediately to their morphological and chemical characterization. This evolution was due to the shifting balance from quality control to root-cause analysis. Root-cause analysis requires a deeper analytical approach to the characterization of the observed defects. Atomic composition may suffice at times as an answer. However, this information may be ambiguous and inadequate. Therefore, deeper chemical information regarding molecular structure and crystallinity of the particle is now required.

The analytical capabilities and versatilities associated with optical spectroscopy inevitably have led to their increasing applications in the semiconductor industry. in particular, the complementary Infrared and Raman spectroscopies on one hand provide huge insight into the molecular structure and crystallinity of the particles, on the other hand Raman and Photoluminescence (PL) spectroscopies are easily coupled to systems providing particle visualization and localization.

Type
Industrial Applications of Optical Spectroscopy in Microanalysis (Organized by F. Adar and A. Whitley)
Information
Microscopy and Microanalysis , Volume 7 , Issue S2: Proceedings: Microscopy & Microanalysis 2001, Microscopy Society of America 59th Annual Meeting, Microbeam Analysis Society 35th Annual Meeting, Long Beach, California August 5-9, 2001 , August 2001 , pp. 154 - 155
Copyright
Copyright © Microscopy Society of America 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

references

1.Steigerwald, J. M., Murarka, S. M. and Gutmann, R. J..in Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York, (1997).CrossRefGoogle Scholar
2.Davenport, R., Brown, B., Integrated CMP Clean Methods, European Semiconductor, (1999).36.Google Scholar