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Enhanced Morphological and Thermal Stabilities of Nickel Germanide with an Ultrathin Tantalum Layer Studied by Ex Situ and In Situ Transmission Electron Microscopy

Published online by Cambridge University Press:  06 August 2013

Jae-Wook Lee
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, SouthKorea
Hyung-Kyu Kim
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, SouthKorea
Jee-Hwan Bae
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, SouthKorea
Min-Ho Park
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, SouthKorea
Hyoungsub Kim
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, SouthKorea
Jiho Ryu
Affiliation:
Department of Automobile Development, Ajou Motor College, Boryeong 355-769, SouthKorea
Cheol-Woong Yang*
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, SouthKorea
*
*Corresponding author. E-mail: cwyang@skku.edu
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Abstract

The formation and morphological evolution of germanides formed in a ternary Ni/Ta-interlayer/Ge system were examined by ex situ and in situ annealing experiments. The Ni germanide film formed in the Ni/Ta-interlayer/Ge system maintained continuity up to 550°C, whereas agglomeration of the Ni germanide occurred in the Ni/Ge system without Ta-interlayer. Through microstructural and chemical analysis of the Ni/Ta-interlayer/Ge system during and after in situ annealing in a transmission electron microscope, it was confirmed that the Ta atoms remained uniformly on the top of the newly formed Ni germanide layer during the diffusion reaction. Consequently, the agglomeration of the Ni germanide film was retarded and the thermal stability was improved by the Ta incorporation.

Type
Research Article
Copyright
Copyright © Microscopy Society of America 2013 

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