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A Novel Acceleration-Factor Equation for Packaging-Solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates

Published online by Cambridge University Press:  12 May 2016

C.-H. Lee ,
K.-C. Wu  and
K.-N. Chiang
C.-H. Lee
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
K.-C. Wu
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
K.-N. Chiang*
Affiliation:
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchu, Taiwan
*
*Corresponding author (knchiang@pme.nthu.edu.tw)
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Abstract

Acceleration-factor (AF) equations have been developed to rapidly predict product lifetime, and the most widely used equation is Norris-Landzberg (N-L) equation. In recent years, some researchers have found that the current AF equation does not accurately predict the experimental results for thermal cyclic loading at high ramp rates; indeed, it may yield the opposite results, due to the changing effect of the solder strain rate at different ramp rates. Modifying the current AF equation to better assess product reliability has thus become an important task for researchers.

In this study, a novel AF equation was developed from a wafer level chip-scale package (WLCSP) under different thermal cyclic loadings. The frequency term used in the N-L equation was replaced with a new term in the proposed AF equation to distinguish between the effects of ramp rate and dwell time under thermal cyclic loading conditions. Proposed AF equation showed a high level of correlation with the simulation and test results for various thermal cyclic loadings. In addition, the proposed AF equation was validated by confirming the consistency of its results with experimental data on a range of packages and thermal-cycling profiles reported in the literature.

Keywords

AF equationRamp rateCreepStrain rate
Type
Research Article
Information
Journal of Mechanics , Volume 33 , Issue 1 , February 2017 , pp. 35 - 40
Copyright
Copyright © The Society of Theoretical and Applied Mechanics 2017 

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References

1. Norris, K. C. and Landzberg, A. H., “Reliability of Controlled Collapse Interconnections,” IBM Journal of Research and Development, 13, pp. 266–271 (1969).Google Scholar
2. Ma, H., “Effects of Temperature and Strain Rate on The Mechanical Properties of Lead-free Solders,” Journal of Materials Science, 45, pp. 2351–2358 (2010).Google Scholar
3. Salmela, O., “Acceleration Factors for Lead-Free Solder Materials,” IEEE Transactions on Components and Packaging Technologies, 30, pp. 700–707 (2007).CrossRefGoogle Scholar
4. Dauksher, W., “A Second-level SAC Solder-Joint Fatigue-Life Prediction Methodology,” IEEE Transactions on Device and Materials Reliability, 8, pp. 168–173 (2008).Google Scholar
5. Lee, J. G. and Subramanian, K. N., “Effects of TMF Heating Rates on Damage Accumulation and Resultant Mechanical Behavior of Sn-Ag based Solder Joints,” Microelectronics Reliability, 47, pp. 118–131 (2007).CrossRefGoogle Scholar
6. Clech, J. P., “Acceleration Factors and Thermal Cycling Test Efficiency for Lead-free Sn-Ag-Cu Assemblies,” Proceedings of the SMTA International Conference, Chicago, U.S.A. (2005).Google Scholar
7. Chuang, W. C. et al., “A Method Integrating Optimal Algorithm and FEM on CMOS Residual Stress,” Journal of Mechanics, 30, pp. 123–128 (2014).CrossRefGoogle Scholar
8. Wu, K. C., Lin, S. Y., Hung, T. Y. and Chiang, K. N., “Reliability Assessment of Packaging Solder Joints under Different Thermal Cycle Loading Rates,” IEEE Transactions on Device and Materials Reliability, 15, pp. 437–442 (2015).Google Scholar
9. Chen, X., Chen, G. and Sakane, M., “Prediction of Stress-strain Relationship with an Improved Anand Constitutive Model for Lead-free Solder Sn-3.5Ag,” IEEE Transactions on Components and Packaging Technologies, 28, pp. 111–116 (2005).Google Scholar
10. Su, F., Li, W. J., Lan, T. B. and Shang, W., “Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package,” Journal of Mechanics, 30, pp. 625–630 (2014).Google Scholar
11. Ma, H., “Constitutive Models of Creep for Lead-free Solders,” Journal of Materials Science, 44, pp. 3841–3851 (2009).Google Scholar
12. Chaparala, S. C. et al., “Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints,” IEEE Transactions on Components and Packaging Technologies, 28, pp. 441–448 (2005).Google Scholar
13. Kang, S. K. et al., “Evaluation of Thermal Fatigue Life and Failure Mechanisms of SnAgCu Solder Joints with Reduced Ag Contents,” Proceedings of the 54th Electronic Components and Technology Conference, Las Vegas, U.S.A. (2004).Google Scholar
14. Pan, N. et al., “An Acceleration Model for SnAgCu Solder Joint Reliability under Various Thermal Cycle Conditions,” Proceedings of the SMTA International Conference, Chicago, U.S.A. (2005).Google Scholar
15. Xiang, D. et al., “High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability,” Proceedings of the 55th Electronic Components and Technology Conference, Lake Buena Vista, U.S.A. (2005).Google Scholar
16. Shih, R. et al., “Reliability of HITCE Ceramic Ball Grid Array Package,” Proceedings of the IMAPS, Philadelphia, U.S.A. (2005).Google Scholar
17. Mattila, T. T., Xu, H., Ratia, O. and Paulasto-Krockel, M., “Effects of Thermal Cycling Parameters on Lifetimes and Failure Mechanism of Solder Interconnections,” Proceedings of the 60th Electronic Components and Technology Conference, Las Vegas, U.S.A. (2010).Google Scholar