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Modeling of Solder Fatigue Failure due to Ductile Damage

Published online by Cambridge University Press:  28 September 2011

K. Aluru ,
F.-L. Wen  and
Y.-L. Shen
K. Aluru*
Affiliation:
Department of Mechanical Engineering, University of New Mexico, Albuquerque, NM 87131, U.S.A.
F.-L. Wen*
Affiliation:
Department of Mechanical and Computer-Aided Engineering, St. John's University, Taipei, Taiwan25135, R.O.C.
Y.-L. Shen*
Affiliation:
Department of Mechanical Engineering, University of New Mexico, Albuquerque, NM 87131, U.S.A.
*
* Graduate Student
** Professor
*** Professor, corresponding author
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Abstract

A numerical study is undertaken to simulate failure of solder joint caused by cyclic shear deformation. A progressive ductile damage model is incorporated into the rate-dependent elastic-viscoplastic finite element analysis, resulting in the capability of simulating damage evolution and eventual failure through crack formation. It is demonstrated that quantitative information of fatigue life, as well as the temporal and spatial evolution of fatigue cracks, can be explicitly obtained.

Keywords

Solder jointFatigueDuctile damagePlastic deformationFinite element analysis
Type
Technical Note
Information
Journal of Mechanics , Volume 26 , Issue 4 , December 2010 , pp. N23 - N27
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2010

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References

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