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Injection Molding Simulation of 3D Stacked-Chip Assembly Packaging with Different Entrances

Published online by Cambridge University Press:  05 May 2011

C.-M. Lin ,
T.-C. Lin ,
H.-M. Chu  and
Y.-L. Chen
C.-M. Lin*
Affiliation:
Department of Mechanical Engineering, WuFeng Institute of Technology, Chia-Yi, Taiwan 62153, R.O.C.
T.-C. Lin*
Affiliation:
Department of Computer Science and Information Engineering, WuFeng Institute of Technology, Chia-Yi, Taiwan 62153, R.O.C.
H.-M. Chu*
Affiliation:
Department of Mechanical Engineering, Yung-Ta Institute of Technology and Commerce, Ping-Tung, Taiwan 90942, R.O.C.
Y.-L. Chen*
Affiliation:
Department of Fire Science, WuFeng Institute of Technology, Chia-Yi, Taiwan 62153, R.O.C.
*
*Associate Professor
**Assistant Professor
**Assistant Professor
*Associate Professor
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Abstract

This paper adopts a three-dimensional (3D) finite element method to simulate the injection molding of organic 3D stacked-chip assemblies. The geometry model of the assembly is simplified to a five-layered structure of stacked-chips with no solder bumps. The injection molding process incorporates 3D stacked-chip packaging and encapsulation techniques, and comprises primarily of multi-layer cavity-filling and reactive-thermosetting curing processes. The current investigation considers the effects of specifying different entrances on the resultant flow fronts, air-traps, and weld-lines. In general, the present results confirm the value of performing numerical simulations of the 3D stacked-chip packaging process to support the injection molding CAE approaches which are commonly applied nowadays to improve the packaging assembly design and to facilitate the rapid set up of mass-production conditions. The simulation results indicate that the best packaging results are obtained when the melt is introduced either at the center of the periphery side of the stacked-chip modulus or at its corner.

Keywords

3D stacked-chip packagingInjection moldingEncapsulationAir-trapWeld-lineThermosettingCuring.
Type
Articles
Information
Journal of Mechanics , Volume 23 , Issue 1 , March 2007 , pp. 31 - 39
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2007

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