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Sintering of Cordierite–borosilicate Glass Composites

Published online by Cambridge University Press:  31 January 2011

Jiin-Jyh Shyu  and
Jui-Kai Wang
Jiin-Jyh Shyu
Affiliation:
Department of Materials Engineering, Tatung University, Taipei 104, Taiwan, Republic of China
Jui-Kai Wang
Affiliation:
Department of Materials Engineering, Tatung University, Taipei 104, Taiwan, Republic of China
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Abstract

The sintering and properties of cordierite–borosilicate glass composites were investigated. For the composites with ≥35% low-viscosity glass, the sintered densities decreased with the increasing sintering temperature above 850 °C. No crystallization of the glass was found. For the composites with 50–90 wt% high-viscosity glass, the sintered densities remained nearly constant (>95%) in a wide sintering temperature range. However, cristobalite crystallized from the glass phase, resulting in an undesirably high coefficient of thermal expansion. Presintering processing and a lower heating rate improved the densification of the composites with low-viscosity glass while limiting that of the composites with high-viscosity glass. This result is explained by the difference in crystallizability between these two glasses. As low- and high-viscosity glass powders were simultaneously added, the density reduction was reduced and the coefficient of thermal expansion was closer to that of Si because of the absence of cristobalite phase. The dielectric constant of all the composites was in the typical range of 4.9–5.7 at 1 MHz.

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 8 , August 2000 , pp. 1759 - 1765
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1.Tummala, R.R., J. Am. Ceram. Soc. 74, 895 (1991).CrossRefGoogle Scholar
2.Knickerbocker, J.U., Am. Ceram. Soc. Bull. 71, 1393 (1992).Google Scholar
3.Knickerbocker, S.H., Kumar, A.H., and Herron, L.W., Am. Ceram. Soc. Bull. 72, 90 (1993).Google Scholar
4.Kumar, A.H., McMillan, P.W., and Tummala, R.R., U.S. Patent No. 4 413 061 (1983).Google Scholar
5.Kondo, K. and Okuyama, M., U.S. Patent No. 4 540 671 (1985).Google Scholar
6.Niwa, K., Imanaka, Y., Kamehara, N., and Aoki, S., in Ceramic Substrates and Packages for Electronic Applications, Advances in Ceramics Vol. 26, edited by Yan, M.F., Niwa, K., O'Bryan, H.M. Jr, and Young, W.S. (The American Ceramic Society, Westerville, OH, 1987), p. 323.Google Scholar
7.Emura, H., Onituka, K., and Maruyama, H., in Ceramic Substrates and Packages for Electronic Applications, Advances in Ceramics Vol. 26, edited by Yan, M.F., Niwa, K., O'Bryan, H.M. Jr, and Young, W.S. (The American Ceramic Society, Westerville, OH, 1987), p. 375.Google Scholar
8.Shimada, Y., Yamashita, Y., and Takamizawa, H., IEEE. Trans. Compon. Hybrids, Manuf. Technol. 11, 163 (1988).CrossRefGoogle Scholar
9.Kata, K., Shimada, Y., and Takamizawa, H., IEEE. Trans. Compon. Hybrids, Manuf. Technol. 13, 448 (1990).CrossRefGoogle Scholar
10.Ewsuk, K.G. and Harrison, L.W., in Ceramic Powder Science III, Ceramic Transactions Vol. 12, edited by Messing, G.L., Hirano, S., and Hausner, H. (The American Ceramic Society, Westerville, OH, 1990), p. 639.Google Scholar
11.Ewsuk, K.G., in Materials and Processes for Microelectronic Systems, Ceramic Transactions Vol. 15, edited by Nair, K.M., Pohanka, R., and Buchanan, R.C. (The American Ceramic Society, Westerville, OH, 1990), p. 279.Google Scholar
12.Gupta, T.K. and Jean, J.H., J. Mater. Res. 11, 243 (1996).CrossRefGoogle Scholar
13.Mattox, D.M., Gurkovich, S.R., Olenick, J.A., and Mason, M., Ceram. Eng. Sci. Proc. 9, 1567 (1988).Google Scholar
14.Jean, J.H. and Gupta, T.K., IEEE Trans. CPMT, Part B 17, 228 (1994).Google Scholar
15.Bridge, D.R., Holland, D., and McMillan, T.W., Glass Technol. 26, 286 (1985).Google Scholar
16.Reed, J.S., Principles of Ceramics Processing, 2nd ed. (John Wiley & Sons, New York, 1995), p. 607.Google Scholar
17.Ewsuk, K.G., Solid State Phenom. 25&26, 63 (1992).CrossRefGoogle Scholar
18.Reed, J.S., Principles of Ceramics Processing, 2nd ed. (John Wiley & Sons, New York, 1995), p. 623.Google Scholar
19.German, R.M., Powder Metallurgy Science, 2nd ed. (Metal Powder Industries Federation, Princeton, NJ, 1994), p. 256.Google Scholar
20.Mattox, D.M., Gurkovich, S.R., Olenick, J.A., and Mason, K.M., Ceramic Substrates and Packages for Electronic Applications, Advances in Ceramics Vol. 26, edited by Yan, M.F., Niwa, K., O'Bryan, H.M. Jr, and Young, W.S. (The American Ceramic Society, Westerville, OH, 1987), p. 431.Google Scholar