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Electron microscopy study of tin whisker growth

Published online by Cambridge University Press:  31 January 2011

J. B. LeBret  and
M. G. Norton
J. B. LeBret
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164–2920
M. G. Norton
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164–2920
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Abstract

The growth of tin whiskers formed on sputtered tin layers deposited on brass was studied using electron microscopy. The occurrence of whiskers appeared to be largely independent of the macroscopic stress state in the film; rather it was microscopic compressive stresses arising from the formation of an intermetallic phase that appeared to be the necessary precursor. Whisker morphology was a result of whether nucleation had occurred on single grains or on multiple grains. In the latter case, the whiskers had a fluted or striated surface. The formation of whiskers on electron transparent samples was demonstrated. These samples showed the whiskers were monocrystalline and defect free, and that the growth direction could be determined.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 3 , March 2003 , pp. 585 - 593
Copyright
Copyright © Materials Research Society 2003

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