Hostname: page-component-848d4c4894-nmvwc Total loading time: 0 Render date: 2024-07-06T16:00:22.116Z Has data issue: false hasContentIssue false
  • English
  • Français

Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu–Al alloys during thermal annealing

Published online by Cambridge University Press:  11 January 2011

X.H. An ,
S. Qu ,
S.D. Wu  and
Z.F. Zhang
X.H. An
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
S. Qu
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
S.D. Wu*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Z.F. Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
*
a)Address all correspondence to these authors. e-mail: shdwu@imr.ac.cn
b)e-mail: zhfzhang@imr.ac.cn
Get access

Abstract

Effects of stacking fault energy (SFE) on the thermal stability and mechanical properties of nanostructured (NS) Cu–Al alloys during thermal annealing were investigated in this study. Compared with NS Cu–5at.%Al alloy with the higher SFE, NS Cu–8at.%Al alloy exhibits the lower critical temperatures for the initiation of recrystallization and the transition from recovery-dominated to recrystallization-dominated process, which significantly signals its low thermal stability. This may be attributed to the large microstructural heterogeneities resulting from severe plastic deformation. With increasing the annealing temperatures, both Cu–Al alloys present the similar trend of decreased strength and improved ductility. Meanwhile, the remarkable enhancement of uniform elongation is achieved when the volume fraction of Static recrystallization (SRX) grains exceeds ~80%. Moreover, the better strength–ductility combination was achieved in the Cu–8at.%Al alloy with lower SFE.

Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 3 , 14 February 2011 , pp. 407 - 415
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Valiev, R.Z. and Langdon, T.G.: Principles of equal-channel angular pressing as a processing tool for grain refinement. Prog. Mater. Sci. 51, 881 (2006).CrossRefGoogle Scholar
2.Meyers, M.A., Mishra, A., and Benson, D.J.: Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51, 427 (2006).CrossRefGoogle Scholar
3.Koch, C.C., Morris, D.G., Lu, K., and Inoue, A.: Ductility of nanostructured materials. MRS Bull. 24, 54 (1999).CrossRefGoogle Scholar
4.Lu, L., Shen, Y.F., Chen, X.H., Qian, L.H., and Lu, K.: Ultrahigh strength and high electrical conductivity in copper. Science 304, 422 (2004).CrossRefGoogle ScholarPubMed
5.Wang, Y.M., Chen, M.W., Zhou, F., and Ma, E.: High tensile ductility in a nanostructured metal. Nature 419, 912 (2002).CrossRefGoogle Scholar
6.Huang, X.X., Hansen, N., and Tsuji, N.: Hardening by annealing and softening by deformation in nanostructured metals. Science 312, 249 (2006).CrossRefGoogle ScholarPubMed
7.Zhao, Y.H., Bingert, J.F., Zhu, Y.T., Liao, X.Z., Valiev, R.Z., Horita, Z., Langdon, T.G., Zhou, Y.Z., and Lavernia, E.J.: Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density. Appl. Phys. Lett. 92, 081903 (2008).CrossRefGoogle Scholar
8.Tsuji, N., Ito, Y., Saito, Y., and Minamino, Y.: Strength and ductility of ultrafine grained aluminum and iron produced by ARB and annealing. Scr. Mater. 47, 893 (2002).CrossRefGoogle Scholar
9.Li, Y.S., Zhang, Y., Tao, N.R., and Lu, K.: Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation. Scr. Mater. 59, 475 (2008).CrossRefGoogle Scholar
10.Valiev, R.Z., Sergueeva, A.V., and Mukherjee, A.K.: The effect of annealing on tensile deformation behavior of nanostructured SPD titanium. Scr. Mater. 49, 669 (2003).CrossRefGoogle Scholar
11.Srinivasarao, B., Oh-ishi, K., Ohkubo, T., Mukai, T., and Hono, K.: Synthesis of high-strength bimodally grained iron by mechanical alloying and spark plasma sintering. Scr. Mater. 58, 759 (2008).CrossRefGoogle Scholar
12.Meyers, M.A. and Chawla, K.K.: Mechanical Behavior of Materials (Prentice Hall, NJ, 1999).Google Scholar
13.Han, W.Z., Zhang, Z.F., Wu, S.D., and Li, S.X.: Combined effects of crystallographic orientation, stacking fault energy and grain size on deformation twinning in FCC crystals. Philos. Mag. 88, 3011 (2008).CrossRefGoogle Scholar
14.Humphreys, F.J. and Hatherly, M.: Recrystallization and Related Annealing Phenomena, 2nd ed. (Elsevier, Oxford, 2004).Google Scholar
15.Qu, S., An, X.H., Yang, H.J., Huang, C.X., Yang, G., Zang, Q.S., Wang, Z.G., Wu, S.D., and Zhang, Z.F.: Microstructural evolution and mechanical properties of Cu–Al alloys subjected to equal channel angular pressing. Acta Mater. 57, 1586 (2009).CrossRefGoogle Scholar
16.An, X.H., Lin, Q.Y., Qu, S., Yang, G., Wu, S.D., and Zhang, Z.F.: Influence of stacking fault energy on the accommodation of severe shear strain in Cu–Al alloys during equal channel angular pressing. J. Mater. Res. 24, 3636 (2009).CrossRefGoogle Scholar
17.An, X.H., Han, W.Z., Huang, C.X., Zhang, P., Yang, G., Wu, S.D., and Zhang, Z.F.: High strength and utilizable ductility of bulk ultrafine-grained Cu–Al alloys. Appl. Phys. Lett. 92, 201915 (2008).CrossRefGoogle Scholar
18.Wu, S.D., An, X.H., Han, W.Z., Qu, S., and Zhang, Z.F.: Microstructure evolution and mechanical properties of fcc metallic materials subjected to equal channel angular pressing. Acta Mater. Sin. 46, 257 (2010).Google Scholar
19.Zhu, Y.T. and Langdon, T.G.: Observations and issues on mechanisms of grain refinement during ECAP process. Mater. Sci. Eng., A 291, 46 (2000).CrossRefGoogle Scholar
20.Humphreys, F.J.: Review grain and subgrain characterisation by electron backscatter diffraction. J. Mater. Sci. 36, 3833 (2001).CrossRefGoogle Scholar
21.Yang, H.J., Xu, Y.B., Seki, Y., Nesterenko, V.F., and Meyers, M.A.: Analysis and characterization by electron backscatter diffraction of microstructural evolution in the adiabatic shear bands in Fe–Cr–Ni alloys. J. Mater. Res. 24, 2617 (2009).CrossRefGoogle Scholar
22.Rohatgi, A. and Vecchio, K.S.: The variation of dislocation density as a function of the stacking fault energy in shock-deformed FCC materials. Mater. Sci. Eng., A 328, 256 (2002).CrossRefGoogle Scholar
23.Paul, H., Driver, J.H., and Jasieński, Z.: Shear banding and recrystallization nucleation in a Cu–2%Al alloy single crystal. Acta Mater. 50, 815 (2002).CrossRefGoogle Scholar
24.Humphreys, F.J.: A unified theory of recovery, recrystallization and grain growth, based on the stability and growth of cellular microstructures—I. The basic model. Acta Mater. 45, 4231 (1997).CrossRefGoogle Scholar
25.Ferry, M. and Humphreys, F.J.: Discontinuous subgrain growth in deformed and annealed {110} 〈001〉 aluminium single crystals. Acta Mater. 44, 1293 (1996).CrossRefGoogle Scholar
26.Huang, Y., Humphreys, F.J., and Ferry, M.: The annealing behaviour of deformed cube-oriented aluminium single crystals. Acta Mater. 48, 2543 (2000).CrossRefGoogle Scholar
27.Wu, S.D., Wang, Z.G., Jiang, C.B., Li, G.Y., Alexandrov, I.V., and Valiev, R.Z.: The formation of PSB-like shear bands in cyclically deformed ultrafine grained copper processed by ECAP. Scr. Mater. 48, 1605 (2003).CrossRefGoogle Scholar
28.Huang, J.Y., Zhu, Y.T., Jiang, H., and Lowe, T.C.: Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening. Acta Mater. 49, 1497 (2001).CrossRefGoogle Scholar
29.Hurley, P.J. and Humphreys, F.J.: Modelling the recrystallization of single-phase aluminium. Acta Mater. 51, 3779 (2003).CrossRefGoogle Scholar
30.Li, Y.S., Tao, N.R., and Lu, K.: Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures. Acta Mater. 56, 230 (2008).CrossRefGoogle Scholar
31.Ma, E., Wang, Y.M., Lu, Q.H., Sui, M.L., Lu, L., and Lu, K.: Strain hardening and large tensile elongation in ultrahigh-strength nano-twinned copper. Appl. Phys. Lett. 85, 4932 (2004).CrossRefGoogle Scholar
32.Zhao, Y.H., Zhu, Y.T., Liao, X.Z., Horita, Z., and Langdon, T.G.: Tailoring stacking fault energy for high ductility and high strength in ultrafine grained Cu and its alloy. Appl. Phys. Lett. 89, 121906 (2006).CrossRefGoogle Scholar