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Residual Stress Measurements on Cr/Ni Pads Evaporated on Polyimide Thin Films

Published online by Cambridge University Press:  06 March 2019

C. C. Goldsmith  and
C. Van Buskirk
C. C. Goldsmith
Affiliation:
IBM Corporation, East Fishkill Facility 1580 Rout 52, Hopewell Junciton NY 12533-6531
C. Van Buskirk
Affiliation:
IBM Corporation, East Fishkill Facility 1580 Rout 52, Hopewell Junciton NY 12533-6531
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Abstract

Polyimide films are becoming more important in multi-layer structures, acting as dielectric films to separate conductive layers. High thin film residual stresses can cause problems with the polyimide film, leading to loss of adhesion between the metal film and the polyimide or can cause cracking in the polyimide.

In this paper, we examine the residual stresses in “as deposited” metal films evaporated onto BTDA-APB polyimide films and follow the change in residual stress of the nickel layer during subsequent thermal processing. We will show that the change in residual stresses can be correlated to the glass transition temperature of the polyimide film.

Type
V. X-Ray Characterization of Thin Films
Information
Advances in X-Ray Analysis , Volume 36: Forty-First Annual Conference on Applications of X-ray Analysis, August 3-7, 1992 , 1992 , pp. 203 - 212
Copyright
Copyright © International Centre for Diffraction Data 1992

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References

1. Tummala, R., Keyes, R., Grobman, W., Kapur, S., Thin Film Packaging” in Microelectronics Packaging Handbook, ed. R. Tummala and E. Rymaszewski, p 673, Van Nostrand Reinhold, Co. Inc. NY 1989 Google Scholar
2. Goldsmith, C., Geldermans, P., Bedetti, F., Walker, G., J. Vac. Sci. Tech., A 1(2) (1983) p. 407 Google Scholar
3. Geldermans, P., Goldsmith, C., Bedetti, F., “Measurement of Stress Generated during Curing and on Cured Polyimide Films,” Polyimides, Vol. 2 , Ed. K. Mittal (1984) p. 695 Google Scholar
4. Eisner, G., J. Appl. Polym. Sci, Vol. 34, (1987) p. 815 Google Scholar
5. Tong, H., Hu, C. K., Feger, C., Ho, P., Poly. Eng. Sci., Vol. 26, No. 17, (1886) p. 1213 Google Scholar
6. Chen, S., Yang, C., Faupel, F., Ho, P., J. Appl. Phys. 64(12) (1988) p. 6690 Google Scholar
7. Weber, W., Ed. Characterization of Thermid IP-6015 Polyimide, IBM Internal Publication (1989)Google Scholar
8. Lund, C., Enhanced Thermid A4-6015 Technology, IBM Internal Publication, (1989)Google Scholar
9. Noyen, I. C., Cohen, J. B., Residual Stress Measurement by Diffraction and Interpretation, Springer-Verlag Inc. NY (1987)Google Scholar