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Macro and Micro-Stress Distributions in Filled Epoxy Systems

Published online by Cambridge University Press:  06 March 2019

L. T. Nguyen  and
I. C. Noyan
L. T. Nguyen
Affiliation:
I.B.M. T. J. Watson Research Center P.O. Box 218 Yorktown Heights, N.Y. 10598
I. C. Noyan
Affiliation:
I.B.M. T. J. Watson Research Center P.O. Box 218 Yorktown Heights, N.Y. 10598
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Abstract

The results of an experimental study on residual stresses within the encapsulation layers of electronic components are described. For this study, silicon wafers were coated with a flexibilized cycloaliphatic formulation filled with 30 and 40 (vol.) % of Cu particles. The residual stresses were determined by measuring the radii of curvature of the encapsulated wafers. The stress in the Cu particles at the surface was also measured by X-Ray diffraction. It was seen that the stresses within the structure are primarily macro-stresses, with little stress present within the Cu particles. Comparison of the experimental values to those calculated from linear elasticity theory also indicate relaxation within the composite during curing.

Type
III. X-Ray Stress/Strain Determination, Fractography, Diffraction, Line Broadening Analysis
Information
Advances in X-Ray Analysis , Volume 31: Thirty-Sixth Annual Conference on Applications of X-ray Analysis, August 3-7, 1987 , 1987 , pp. 223 - 230
Copyright
Copyright © International Centre for Diffraction Data 1987

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References

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