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Hydrogenated amorphous silicon (a-Si:H) n-i-p photodiodes may be used as the pixel sensor element in large-area array imagers for medical diagnostics applications. The dark current level is an important parameter that dictates the performances of these types of pixelated imaging devices. Through measurements performed at different ambient temperatures, the leakage current components of segmented a-Si:H n-i-p photodiodes were extracted and analyzed. It was found that the central component of the reverse current depends exponentially on bias and temperature. The activation energy of this component is independent of bias. The peripheral component of reverse current exhibits linear bias dependence at temperatures up to 50°C, while the contribution of this component diminishes at high temperatures. The dependence of dark current components on bias and temperature could be described by compact analytical equations. The model of forward and reverse dark current characteristics in temperature range was implemented in Verilog-A hardware description language.
We report on the fabrication and characterization of hydrogenated amorphous silicon (a-Si:H) films and n-i-p photodiodes on glass and PEN plastic substrates using low-temperature (150°C) plasma-enhanced chemical vapor deposition. Process conditions were optimized for the i-a-Si:H material which had a band gap of ~1.73 eV and low density of states (of the order 1015 cm-3). Diodes with 0.5 μm i-layer demonstrate quantum efficiency ~70%. The reverse dark current of the diodes on glass and PEN plastic substrate is ~10-11 and below 10-10 A/cm2, respectively. We discuss the difference in electrical characteristics of n-i-p diodes on glass and PEN in terms of bulk- and interface-state generation currents.
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