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Nanotopography impact in shallow-trench isolation chemical mechanical polishing—analysis method and consumable dependence
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 6 / June 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 1783-1790
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- June 2004
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Influence of the electrokinetic behaviors of abrasive ceria particles and the deposited plasma-enhanced tetraethylorthosilicate and chemically vapor deposited Si3N4 films in an aqueous medium on chemical mechanical planarization for shallow trench isolation
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 9 / September 2003
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2163-2169
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- September 2003
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Subsurface Damage Characterization of Hydrogen Ion Implanted Silicon Wafer with Uv/Millimeter-Wave Technique
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- Journal:
- MRS Online Proceedings Library Archive / Volume 631 / 2000
- Published online by Cambridge University Press:
- 10 February 2011, AA1.8
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- 2000
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Subsurface Damage Profile Characterization of Si Wafers with Uv/Millimeter-Wave Technique and Light Scattering Topography
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- Journal:
- MRS Online Proceedings Library Archive / Volume 631 / 2000
- Published online by Cambridge University Press:
- 10 February 2011, AA1.9
- Print publication:
- 2000
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