4 results
Newly Developed Abrasive-free Copper CMP Slurry Based on Electrochemical Analysis
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- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C03-01
- Print publication:
- 2007
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- Article
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Development and Application of an Abrasive-Free Polishing Solution for Copper
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- Journal:
- MRS Bulletin / Volume 27 / Issue 10 / October 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 772-775
- Print publication:
- October 2002
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- Article
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Development of “New Abrasive-Free Copper CMP Solutions” BASED on Electrochemical and Film Analysis Method
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- Journal:
- MRS Online Proceedings Library Archive / Volume 732 / 2002
- Published online by Cambridge University Press:
- 01 February 2011, I1.2
- Print publication:
- 2002
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- Article
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Why abrasive free Cu slurry is promising?
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- Journal:
- MRS Online Proceedings Library Archive / Volume 671 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, M1.3
- Print publication:
- 2001
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- Article
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