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Strains and Relaxations Near metal Alumlnide/Semiconductor Interfaces

Published online by Cambridge University Press:  26 February 2011

W.W. Gerberich ,
J.E. Angelo ,
R.R. Keller ,
A.M. Wowchak  and
P.I. Cohen
W.W. Gerberich
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
J.E. Angelo
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
R.R. Keller
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
A.M. Wowchak
Affiliation:
Dept of Electrical Engineering, University of Minnesota, Minneapolis, MN 55455
P.I. Cohen
Affiliation:
Dept of Electrical Engineering, University of Minnesota, Minneapolis, MN 55455
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Abstract

Mechanisms and phenomena of strain relaxation at bi-material interfaces have been studied for over half a century. The details, however, and limiting kinetics, thermodynamics and mechanics are still being sorted out - particularly for large misfit systems. Three techniques are required to accurately portray strain distributions during and after epitaxial growth: RHEED, TEM and SACP. Reflection high energy electron diffraction (RHEED) is used to measure the lattice parameter during growth. Both transmission electron microscopy (TEM) and selected area electron channeling pattern (SACP) analysis are necessary to identify the defects and the strain distribution. These techniques have been applied to NiAl and FeAl grown by MBE on GaAs with a thin AlAs buffer layer. It is shown that both island and layer by layer growth can occur with the corresponding defects being remarkably similar in character. From a combined Moiré, HREM and computer simulation, the dislocation character is assessed. Both <100> dislocations from half-loops or island edges may occur providing only partial relaxation of the film-substrate systems. The impact of the remaining elastic strain distribution on kinetic measurements of dislocation velocities is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 279
Copyright
Copyright © Materials Research Society 1991

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