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Curvature Measurements of Tri-Material Structures Under Thermal Excursion

  • Guo-Quan Lu (a1), Boris Mogilevsky (a1) and Tapan K. Gupta (a1)

Abstract

The bending curvatures of tri-material plates have been measured using in situ laser reflection technique at temperatures ranging from 20°C to 160°C. The tri-material structures are formed by attaching silicon wafers to ceramic substrates with die-attach adhesives from solder-like (elastic modulus ≈ 24 GPa) to gel-like (elastic modulus ≈ 0.003 GPa) characteristics. The temperature dependence of curvature as a result of the thermal expansion mismatch is measured. The structure bonded by the gel-like adhesive has substantially lower, about a factor of ten less, bending than the structures attached by the other two types of adhesives. We found good agreements between the measurements and the theoretical derivations by Suhir[1] for the bending curvature of finite tri-material assembly.

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[1]. Suhir, E., in Proc. Int. Syrup. on Microelectronics, Atlanta, GA., 1986, pp. 383392.
[2]. Johnson, E.A., Chen, W.T., and Lim, C.K., in Principles of Electronic Packaging, edited by Seraphim, D.P. et al. (McGraw-Hill, 1989), pp. 159195.
[3]. Feinstein, L.G., in Electronic Packaging Handbook, Vol.1, prepared by the ASM International Committee (Materials Park, OH., 1986) pp. 213224.
[4]. McClintock, F.A. and Akgon, A.S., Mechanical Behavior of Materials (Addison-Wesley, N.Y., 1966), P. 351.

Curvature Measurements of Tri-Material Structures Under Thermal Excursion

  • Guo-Quan Lu (a1), Boris Mogilevsky (a1) and Tapan K. Gupta (a1)

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