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Practical considerations in Megasonic Wafer Cleaning

Published online by Cambridge University Press:  10 February 2011

R. Mark Hall
Affiliation:
SCP Global Technologies, 400 Benjamin Lane, Boise ID 83642, markhall@smtp.scpboi.com
Taura Jarvis
Affiliation:
SCP Global Technologies, 400 Benjamin Lane, Boise ID 83642, markhall@smtp.scpboi.com
Thad Parry
Affiliation:
SCP Global Technologies, 400 Benjamin Lane, Boise ID 83642, markhall@smtp.scpboi.com
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Abstract

In this study, critical hardware and process parameters are evaluated for their effect on performance in megasonic cleaning applications. Experimental data is presented which shows the impact of transducer design, bath temperature, process time, SC1 chemistry, and wafer gap spacing on particle removal and surface roughness. The ability to remove particles smaller than 0.1 um in size is also demonstrated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

1. The National Technology Roadmap, 1994, pp. 126–127.Google Scholar
2. Hall, R.M. et al. , in IPA Vapor Jet Drying and its Effect on Critical Process Parameters, (Proceedings: Microcontamination-94, Santa Monica, CA, 1994) pp. 621629.Google Scholar
3. Christenson, et al. et. al., Preparation of Si3N 4 Particle Challenge Wafers, (Proceedings: Institute of Environmental Sciences, Mount Prospect, IL, 1996) pp. 112119.Google Scholar
4. Resnick, P.J. et al. , in A Design of Experiments Approach to an Optimized SC-1/Megasonic Clean for Sub-0.15 Micron Particle removal, edited by Ruzyllo, J. and Novack, R., (ECS, PV94–7, Pennington, NJ, 1994) pp. 450457.Google Scholar
5. Hall, R.M. et al. , in Optimization of SCI-Megasonic Cleaning Efficiency for 200 mm Wafer Processing, (Proceedings: Microcontamination-94, Santa Monica, CA, 1994) pp. 529–537.Google Scholar
6. Cohen, S.L. et al. , Studies of the Relationship Between Megasonics, Surface Etching, and Particle Removal in SC-1 Solutions, edited by Liehr, M., Heyns, M., Hirose, M., and Parks, H., (Mater. Res. Soc. Proc. 386, Pittsburgh, PA, 1995) pp. 1319.Google Scholar

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