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Low-cost eWLB packaging for automotive radar MMICs in the 76–81 GHz range

  • J. Böck (a1), M. Wojnowski (a1), C. Wagner (a2), H. Knapp (a1), W. Hartner (a3), M. Treml (a2), F. J. Schmückle (a4), S. Sinha (a4) and R. Lachner (a1)...

Abstract

Embedded wafer-level ball grid array (eWLB) is investigated as a low-cost plastic package for automotive radar applications in the 76–81 GHz range. Low transmission losses from chip to package and board are achieved by appropriate circuit and package design. Special measures are taken to effectively remove the heat from the package and to optimize the package process to achieve automotive quality targets. A 77 GHz radar chip set in eWLB package is developed, which can be applied on the system board using standard solder reflow assembly. These radar MMICs provide excellent radio frequency (RF) performance for the next generation automotive radar sensors. The potential for even higher system integration is shown by a radar transceiver with antennas integrated in the eWLB package. These results demonstrate that eWLB technology is an attractive candidate to realize low-cost radar systems and to enable radar safety affordable for everyone in the near future.

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Corresponding author

Corresponding author: J. Böck Email: josef.boeck@infineon.com

References

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[1]Böck, J. et al. : SiGe bipolar technology for automotive radar applications, in Proc. Bipolar/BiCMOS Circuits and Technology Meeting, 2004, 8487.
[2]Freundt, D.; Lucas, B.: Long range radar sensor for high-volume driver assistance systems market, in Proc. SAE World Congress and Exhibition, 2008, pp. 117124.
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[4]Wojnowski, M. et al. : A 77 GHz SiGe mixer in an embedded wafer level BGA package, in Proc. 58th Electronic Components and Technology Conference (ECTC), 2008.
[5]Wojnowski, M. et al. : Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications, in Proc. 13th Electronic Packaging Technology Conference (EPTC), 2011.
[6]Knapp, H. et al. : Three-channel 77 GHz automotive radar transmitter in plastic package, in IEEE Radio Frequency Integrated Circuits Symp., 2012.
[7]Wagner, C. et al. : A 77 GHz automotive radar receiver in a wafer level package, in IEEE Radio Frequency Integrated Circuits Symp., 2012.
[8]Trotta, S. et al. : An RCP Packaged Transceiver Chipset for Automotive LRR and SRR Systems in SiGe BiCMOS Technology. IEEE Trans. Microw. Theory Tech., 60 (3) (2012), 778794.
[9]Wojnowski, M.; Wagner, C.; Lachner, R.; Böck, J.; Sommer, G.; Pressel, K.: A 77-GHz SiGe single-chip four-channel transceiver module with integrated antennas in embedded wafer-level BGA package, in Proc. 62nd Electronic Components and Technology Conference (ECTC), 2012.

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