An indexed offset distance of the tricuspid septal leaflet ⩾8 mm/m2 is a quantitative criterion for the diagnosis of Ebstein’s anomaly. The purpose of this study was to investigate the validity of this criterion for the discrimination of Ebstein’s anomaly from pulmonary atresia with intact ventricular septum in neonatal patients. A total of 122 neonatal patients, 56 with Ebstein’s anomaly and 66 with pulmonary atresia with intact ventricular septum, were enrolled. Diagnosis of each anomaly was based on typical morphologic features. Echocardiographic variables, including the offset distance of the tricuspid septal leaflet, were measured via an offline analysis of images recorded before 1 month of age. The offset distance of the tricuspid septal leaflet was indexed by the body surface area, and the indexed offset distances in the Ebstein’s anomaly and pulmonary atresia with intact ventricular septum groups were 34.2 mm/m2 (7.1–119.1 mm/m2) and 7.2 mm/m2 (0.0–25.6 mm/m2), respectively. The indexed offset distance was ⩾8 mm/m2 in 29 (43.9%) of the patients with pulmonary atresia with intact ventricular septum; clinical and echocardiographic characteristics were comparable between these 29 patients and the remaining 37 patients with pulmonary atresia with intact ventricular septum. When an indexed offset distance ⩾8 mm/m2 was applied as a cut-off for the diagnosis of Ebstein’s anomaly, the sensitivity was 0.963 and the specificity was 0.561. In conclusion, indexed offset distance ⩾8 mm/m2 cannot be used as a cut-off for the diagnosis of complicated Ebstein’s anomaly in neonatal patients with pulmonary atresia with intact ventricular septum.

The aim of the present study was to investigate the effects of oral administration of the insulin-like growth factor-I-rich fraction (IGF-I-RF) from bovine colostral whey on the regulation of blood glucose levels in streptozotocin (STZ)-induced diabetic mice. We obtained a peptide fraction containing IGF-I (10 ng/mg protein) from Holstein colostrum within 24 h after parturition by using ultrafiltration. The blood glucose levels of STZ-induced diabetic mice fed with IGF-I-RF (50 μg/kg per d) were significantly reduced by 11 and 33 % at weeks 2 and 4, respectively (P < 0·05). The body weights of STZ-induced diabetic mice increased following the oral administration of the IGF-I-RF. The kidney weights of STZ-induced diabetic mice decreased significantly (P < 0·05) following the administration of the IGF-I-RF, and the liver weights of STZ-induced diabetic mice decreased significantly (P < 0·05) following the administration of 50 μg/kg per d of the IGF-I-RF. The present results indicate that the IGF-I-RF obtained from Holstein colostrum could be a useful component for an alternative therapeutic modality for the treatment of diabetes in insulin-resistant patients.

Varying amounts of Zn (1, 3, 7 wt%) were added to Sn–3.5Ag solder on the electroless Ni(P)/immersion Au metallization, and solder joint microstructures after reflow and isothermal aging (500 h at 150 °C) were investigated using scanning electron microscopy, energy dispersive x-ray spectroscopy, transmission electron microscopy, and x-ray diffraction, which were subsequently correlated to the microhardness and drop test results. Zinc in the solder affected the solder joint intermetallic compounds profoundly, which improved the drop reliability significantly. The effect of Zn was to nucleate Ni5Zn21 and to suppress the formation of Ni3P, Ni3SnP, and Ni3Sn4, which were known to increase the propensity for brittle cracking. Drop test results showed an inverse correlation between the number of drops-to-failure (Nf) and the thickness of Ni3P layer. As the growth of the Ni3P layer was suppressed by Zn, drop reliability increased substantially.

Varying amounts of Zn (1, 3, and 7 wt%) were added to Sn–3.5Ag solder on a Cu pad, and the resultant solder joint microstructures after a reflow and isothermal aging (150 °C, up to 500 h) were investigated using scanning electron microscopy, energy dispersive x-ray, and x-ray diffraction, which were subsequently correlated to the results of microhardness and drop tests. Zinc was effective in improving the drop resistance of Sn–3.5Ag solder on the Cu pad, and an addition of 3 wt% Zn nearly doubled the number of drops-to-failure (Nf). The beneficial role of Zn was ascribed to suppression of Cu6Sn5 and precipitation of Zn-containing intermetallic compounds (IMCs). However, the Zn effect was reduced as Cu6Sn5 and Ag3Sn precipitated in a joint IMC layer after prolonged aging. The interface between Ag5Zn8 and Cu5Zn8 was resistant to drop impact, but two other layered IMC structures of Cu6Sn5/Cu3Sn and Cu5Zn8/Cu6Sn5 were not.