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Thick AlGaN layers and GaN/AlGaN heterostructures were grown by low pressure MOCVD on (0001) sapphire substrates utilizing a low temperature AlGaN buffer layer. The distribution of Al in the thick AlGaN layers was observed to be non-uniform as a function of depth. The Al content gradually increases from the substrate towards the epilayer surface. Moreover, fluctuations of Al content are also noticeable. The saturation of impurity-related emission with increasing current density was observed in EL spectra of LEDs consisting of AlGaN/GaN/AlGaN DH sandwiched by a 2 μm-thick bottom layer of GaN:Si and 0.5 μm-thick layer of GaN:Mg. The dominant near-band edge emission of the GaN active layer was found to be strongly absorbed in the thick bottom layer. Utilizing a 2 μm-thick AlGaN bottom layer instead of the GaN one allowed the absorption edge to be shifted towards higher energies. A single peak at 362 nm with FWHM of 14 nm was observed in this type of LED. Luminescence properties of various types of heterostructures are also discussed.
Undoped and Si-doped GaN films were grown by low pressure MOCVD on (0001) sapphire substrates. The angular distribution of the X-ray diffraction corresponding to the (0002), (0004), (100), (200), and (114) reflections has been measured by means of double- and triple -crystal diffractometry with Mo Kα1 and Cu Kα1 radiation under conditions of symmetrical and asymmetrical Bragg- and Laue-geometry. In our experiments a non-coplanar geometry was also applied. On the basis of the performed studies, five independent components of the tensor of microdistortion were evaluated and the average grain-size in two directions was determined. The type, position, and density of dislocations were established as well. The role of dislocations in strain relaxation and their influence on the optical and electrical properties are discussed.
In this study, both single undoped GaN epilayers and GaN-based device structures was treated by electrochemical etching in the dilute water solution of KOH or NaOH. Our investigations showed that in the undoped GaN epilayers grown by MOCVD the electrical and optical properties were nonuniform in depth. In this case, high defective and high conductive sublayer adjacent to the substrate was revealed by the electrochemical etching. This high conductive region was proved to condition the results of Hall effect measurements. Electrolyte etching of i-n GaN-based device structures grown by HVPE gave rise to significant increasing of the electroluminescence intensity. Influence of electrochemical etching on luminescence properties of the device structure is discussed.
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