4 results
Determining Pad-Wafer Contact using Dual Emission Laser Induced Fluorescence
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- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C01-04
- Print publication:
- 2007
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Quantitative In-Situ Measurement of Asperity Compression Under the Wafer During Polishing
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W5.4
- Print publication:
- 2005
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Instantaneous Fluid Film Imaging in Chemical Mechanical Planarization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W2.3
- Print publication:
- 2005
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The Effect of Wafer Shape on Slurry Film Thickness and Friction Coefficients in Chemical Mechanical Planarization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 613 / 2000
- Published online by Cambridge University Press:
- 14 March 2011, E1.2.1
- Print publication:
- 2000
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