AlGaN/GaN High Electron Mobility Transistors were exposed to 60Co gamma-irradiation to doses up to 300Gy. The impact of Compton- electron injection (due to gamma-irradiation) is studied through monitoring of minority carrier transport using Electron Beam Induced Current (EBIC) technique. Temperature dependent EBIC measurements were conducted on devices before and after exposure to the irradiation, which provide us with critical information on gamma-irradiation induced defects in the material. As a result of irradiation, minority carrier diffusion length increases significantly, with an accompanying decrease in the activation energy. This is consistent with the longer life time of minority carrier in the material’s valence band as a result of an internal electron injection and subsequent trapping of Compton electrons on neutral levels.

GaAs based metamorphic and pseudomorphic high electron mobility transistors (HEMTs) under DC and thermal stress were studied. InAlAs/InGaAs MHEMTs grown on GaAs substrates were stressed at a drain voltage bias of 2.7V for 36 hours as well as thermally stressed at 250°C for 36 hours. Under both stress conditions, the drain current density decreased about 12.5%. The gate current, however, increased more after the thermal storage as opposed to DC bias. Reaction of the Ohmic contact with the underlying semiconductor was the main cause of degradation after thermal stressing. Transmission electron microscopy verified that gate sinking occurred in devices that underwent DC bias stressing. InGaAs pHEMTs that received a 1000 hour lifetime stress test from a commercial vendor showed similar degradation as virgin devices when stressed under DC bias for 24 hours. Virgin devices that were thermally stressed while undergoing DC bias showed minimal degradation up to 120°C, but exhibited catastrophic failure at 140°C.

Samarium oxide (Sm2O3) and samarium gallium oxide (SmxGa1-x)2O3 have been proposed as candidate dielectric materials for the development of gallium arsenide (GaAs) Metal Oxide Semiconductor Field Effect Transistor (MOSFET) technology. Growth of thin (20nm-50nm) Sm2O3 and (SmxGa1-x)2O3 layers on GaAs substrates via plasma-assisted molecular beam epitaxy (MBE) has been performed using a range of growth temperatures and samarium cell temperatures. X-ray photoelectron spectroscopy (XPS) of the deposited films showed evidence of unbonded Sm metal in the films which decreased with decreasing Sm cell temperature, but was relatively independent of substrate temperature. Stoichiometry of the oxide was found to be independent of substrate temperature, but increased in oxygen to metal ratio as the Sm cell temperature was decreased. Decreasing the Sm cell temperature also suppressed the formation of the monoclinic phase and promoted the growth of the cubic phase. Films grown at higher (500şC) temperature showed the presence of a crystalline interface, but relatively high surface roughness and the presence of multiple crystalline phases. Current-voltage analysis of one hundred micron diameter MOS diodes showed breakdown fields at 1 mA/cm2 of up to 4.35 MV/cm. Breakdown field was found to decrease with increasing Sm unbonded metal content in the films. The effect of stoichiometry and phase distribution on the interface state density (Dit) and capacitance-voltage behavior of MOS diodes was also investigated.

ZnO is a very promising material for spintronics applications, with many groups reporting room temperature ferromagnetism in films doped with transition metals during growth or by ion implantation. In films doped with Mn during PLD, we find an inverse correlation between magnetization and electron density as controlled by Sn doping. The saturation magnetization and coercivity of the implanted single-phase films were both strong functions of the initial anneal temperature, suggesting that carrier concentration alone cannot account for the magnetic properties of ZnO:Mn and factors such as crystalline quality and residual defects play a role. Plausible mechanisms for the ferromagnetism include the bound magnetic polaron model or exchange is mediated by carriers in a spin-spilt impurity band derived from extended donor orbitals. Spin-dependent phenomena in ZnO may lead to devices with new or enhanced functionality, such as polarized solid-state light sources and sensitive biological and chemical sensors.

GaN films were doped with Eu to a concentration of ∼0.12 at. % during growth at 800°C by molecular beam epitaxy, with the Eu cell temperature held constant at 470°C. All samples were post-annealed at 675°C. The films exhibited strong photoluminescence (PL) in the red (622 nm) whose absolute intensity was a function of the Ga flux during growth, which ranged from 3-5.4×10−7 Torr. The maximum PL intensity was obtained at a Ga flux of 3.6×10−7 Torr. The samples showed room temperature ferromagnetism with saturation magnetization of ∼0.1-0.45 emu/cm3, consistent with past reports where the Eu was found to be predominantly occupying substitutional Ga sites. There was an inverse correlation between the PL intensity and the saturation magnetization in the films. X-ray diffraction showed the presence of EuGa phases under all of our growth conditions but these cannot account for the observed magnetic properties.

Effects of 10 MeV electron and fast reactor neutron irradiations on carrier removal rate and deep traps spectra were compared for undoped n-GaN samples. It is shown that for electron irradiation the carrier removal rate is well accounted for by the difference in introduction rates of nitrogen-vacancy-related donors with activation energy 0.2 eV and of nitrogen-interstitial-related acceptors at Ec-1.2 eV. In the case of neutron irradiation the introduction rate of all deep traps was much lower than the carrier removal rate indicating that the main contribution to electron removal was due to disordered regions. These regions give rise to a marked persistent photocapacitance signal and a hole-trap-like feature in deep traps spectra. The Fermi level position in the core of disordered regions is located near Ec-(0.85-1) eV.

The development of new etching and contact metallurgies for the ZnO/ZnMgO/ZnCdO materials system and various approaches for realizing ZnO LEDs are reviewed. ZnO nanorod MOSFETs and pH sensors have been demonstrated. In addition, selective detection of hydrogen with Pt-coated single ZnO nanorods is discussed discussed. The Pt-coated single nanorods show a current response approximately a factor of three larger at room temperature upon exposure to 500ppm H2 in N2 than thin films of ZnO. The power consumption of these sensors can be very small (in the nW range) when using discontinuous coatings of Pt. Once the Pt coating becomes continuous, the current required to operate the sensors increases to the μW range. The ZnO nanorods are insensitive to oxygen in the measurement ambient.

ZnO is a very promising material for spintronics applications, with many groups reporting room temperature ferromagnetism in films doped with transition metals during growth or by ion implantation. In films doped with Mn during PLD, we find an inverse correlation between magnetization and electron density as controlled by Sn doping. The saturation magnetization and coercivity of the implanted single-phase films were both strong functions of the initial anneal temperature, suggesting that carrier concentration alone cannot account for the magnetic properties of ZnO:Mn and factors such as crystalline quality and residual defects play a role. Plausible mechanisms for the ferromagnetism include the bound magnetic polaron model or exchange is mediated by carriers in a spin-split impurity band derived from extended donor orbitals. We will also review progress in ZnO nanowires. The large surface area of nanorods makes them attractive for gas and chemical sensing, and the ability to control their nucleation sites makes them candidates for micro-lasers or memory arrays. Single ZnO nanowire depletion-mode metal-oxide semiconductor field effect transistors exhibit good saturation behavior, threshold voltage of ∼-3V and a maximum transconductance of 0.3 mS/mm. Under UV illumination, the drain-source current increased by approximately a factor of 5 and the maximum transconductance was ∼ 5 mS/mm. The channel mobility is estimated to be ∼3 cm2 /V.s, comparable to that for thin film ZnO enhancement mode MOSFETs and the on/off ratio was ∼25 in the dark and ∼125 under UV illumination. Pt Schottky diodes exhibit excellent ideality factors of 1.1 at 25 °C, very low reverse currents and a strong photoresponse, with only a minor component with long decay times thought to originate from surface states. In the temperature range from 25–150 °C, the resistivity of nanorods treated in H2 at 400 °C prior to measurement showed an activation energy of 0.089 eV and was insensitive to the ambient used. By contrast, the conductivity of nanorods not treated in H2 was sensitive to trace concentrations of gases in the measurement ambient even at room temperature, demonstrating their potential as gas sensors. We have also made sensitive pH sensors using single ZnO nanowires.

Epitaxial growth of the ferromagnetic semiconductors GaMnP:C and GaMnN has been investigated by Gas Source Molecular Beam Epitaxy (GSMBE). GaMnP:C films grown with 9.4% Mn are found to be p-type with hysteretic behavior to room temperature. GaMnN films grown at 700 °C with 2.8% Mn show hysteresis at 300 K, while temperature-dependent magnetization measurements indicate that the magnetism may persist to much higher temperatures (> 325 K). Samples of AlGaMnN have also been prepared for the first time that show improved surface morphology compared to GaMnN but which show only paramagnetic behavior.

Epitaxial growth of the dilute magnetic semiconductors GaMnP and GaMnN has been investigated by Gas Source Molecular Beam Epitaxy (GSMBE). GaMnP films grown with < 4.5% Mn show the preferential formation of the second phases MnP and Mn5.64P3, resulting in only a slight deviation from purely diamagnetic behavior. GaMnN films grown on both Al2O3 and Metal-Organic Chemical Vapor Deposition (MOCVD) derived GaN surfaces show strong ferromagnetism when grown with either C codoping or at elevated temperatures to raise the concentration of n-type carriers. Comparable GaMnN films grown under conditions which produce highly resistive material show only paramagnetism, indicating the importance of carrier concentration on the resulting magnetic behavior. The formation of second phases was not observed in the GaMnN material for Mn concentrations less than 9%.

The addition of GaN, A1N, InN, and related alloys to the family of device-quality semiconductors has opened up new opportunities in short-wavelength (visible and ultraviolet [uv]) photonic devices for display and data-storage applications, solar-blind uv detectors, and high-temperature/high-power electronics. Silicon will of course continue to dominate in microelectronics applications, and InP and GaAs and their related alloys will be the mainstays of long-wavelength lightwave communication systems and red, orange, and yellow light-emitting-diode (LED) technology, respectively. There are however many existing and emerging uses for wide-bandgap semiconductors with good electrical and optical characteristics. The purpose of this issue of MRS Bulletin is to furnish a background and summary on the exciting new developments involving GaN and related materials.

Strong efforts on the synthesis and device aspects of GaN took place in the 1960s and 1970s because of the potential for realization of blue lasers and LEDs that would extend the existing wavelength range of photonic devices. Progress was hampered because of several severe materials problems. First there was no bulk crystal growth technology for producing substrates, and epitaxial material was grown on highly lattice-mismatched substrates such as sapphire. This heteroepitaxial material was invariably highly conducting because of residual shallow donor defects or impurities. These high n-type backgrounds, combined with the relatively deep ionization levels of all of the common p-type dopant impurities, prevented the achievement of p-type doping and therefore of bipolar or injection devices.

With great attention now being given to the wide band gap materials for electronic and optoelectronic device applications, there is interest in using ion implantation to introduce dopants into selected regions of devices. Work on ion implantation into SiC and the III-V nitrides is reviewed, new device concepts are given, and recent results are presented. These include SiC implantations at elevated temperatures, a GaN sample implanted with Si having an electron mobility after annealing of 106 cm2/V-s, and a novel GaN np junction diode created by implantation.