In this study, the effect of acceleration matching according to sensor specifications in rapid transfer alignment is analysed. In general, the velocity and attitude information of the Master Inertial Navigation System (MINS) is used for transfer alignment. MINS angular velocity information is used to improve the alignment speed in shipboard transfer alignment. Acceleration matching, on the other hand, is generally considered an impractical option for transfer alignment. However, in the case of shipboard transfer alignment, acceleration matching is thought to be effective. In order to analyse the performance of acceleration matching, a performance index is defined and the efficiency of acceleration matching is analysed according to various sensor specifications and simulation environments. Based on the analysis of the estimated performance according to the simulation results, it is confirmed that acceleration matching in rapid transfer alignment is valid.

The role of the size of amorphous silicon quantum dots in the Er luminescence at 1.54 μm was investigated. As the dot size was increased, the more Er ions were located near one dot due to its large surface area and more Er ions interacted with other ones. This Er-Er interaction caused a weak photoluminescence intensity despite the increase in the effective excitation cross section. The critical dot size, needed to take advantage of the positive effect on Er luminescence, is considered to be about 2.0 nm, below which a small dot is very effective in the efficient luminescence of Er.

It is still unclear whether nuclear envelope breakdown and premature chromosome condensation are essential for the reprogramming of the donor nucleus following somatic nuclear transfer. To address this, we determined the ability of delayed-activated or simultaneously activated porcine oocytes to undergo nuclear remodelling and development following somatic cell nuclear transfer. A small microtubule aster was observed in association with decondensed chromatin following nuclear transfer, suggesting the introduction of a somatic cell centrosome. In the delayed-activated condition, most fibroblast nuclei divided into two chromosome masses and two pronuclear-like structures following transfer into oocytes. In contrast, fibroblast nuclei in the simultaneously activated condition formed a large, swollen, pronuclear-like structure. Microtubule asters were organised in the vicinity of the nucleus regardless of the number of nuclei. More reconstructed oocytes developed to the blastocyst stage in the delayed-activated condition than in the simultaneously activated condition (p < 0.05). Nine piglets were born from two recipient sows following transfer of delayed-activated reconstructed oocytes, while none developed to full term in the simultaneously activated condition. Fingerprint analysis showed that the PCR-RFLP patterns of the nine offspring were identical to that of the donor pig. These results suggest that the activation of recipient oocytes during nuclear transfer probably relates to the nuclear remodelling process, which can affect the ability of embryos created by somatic cell nuclear transfer to develop.

A low resistance Ohmic contact to p-type GaN is essential for reliable operation of electronic and optoelectronic devices. Such contacts have been made using Ni/Au and Pd / Au contacts to p-type Mg-doped GaN (1.41×1017 cm−3) grown by metalorganic chemical vapor deposition ( MOCVD ) on ( 0001 ) sapphire substrates. Thermal evaporation was used for the deposition of those metals followed by annealing at temperatures of 400 ∼ 700 °C in an oxygen and nitrogen mixed gas ambient, then subsequently cooled in liquid nitrogen which reduced the specific contact resistance from the range of 9.46∼2.80×10−2 Ωcm2 to 9.84∼2.65×10−4 Ωcm2 for Ni/Au and from the range of 8.35∼5.01×10−4 Ωcm2 to 3.34∼1.80×10−4 Ωcm2 for Pd/Au. The electrical characteristics for the contacts were examined by the current versus voltage curves and the specific contact resistance was determined by use of the circular transmission line method (c-TLM). The effects of the cryogenic process on improving Ohmic behavior (I-V linearity) and reducing the specific contact resistance will be discussed from a microstructural analysis which reveals the metallurgy of Ohmic contact formation.

Amorphous silicon quantum dots (a-Si QDs), which show a quantum confinement effect, were grown in a silion nitride film by plasma enhanced chemical vapor deposition. Red, green, blue, and white photolumiscence were observed from the a-Si QD strictures by controlling the fot size. An organe light-emitting device (LED) was fabricated using a-Si QDs with a mean size of 2.0 nm. The turn-on vottage was less than 5 V. An external quantum effiency of 2×10−3 % was also demonstrated. These results show that an LED using a-Si QDs embedded in the silicon nitride film is superior in terms of electrical and optical properties to other Si-based LEDs.

Capacitance-voltage was investigated for amorphous silicon quantum dots (a-Si QDs) embedded in a silicon nitride as a function of dot size and nitride thickness. a-Sci QDs were grown by plasma enhanced chemical vapor deposition. The electron charging was decreased as the dot size was decreased. These results showed that the conduction band shift is larger than the valence band shift as the dot size decreased and, as a result, electrons are easily discharged in a-Si QDs due to the lower barrier height. For high dot-density-sample, the capacitance-voltage curves were also shifted toward the negative voltage direction when a higher forward bias was applied at forward condition due to the transfer of electrons trapped in the a-Sci QDs from the a-Sci QDs near Si substrate to those near the top metal.

Two-step surface-treatment is introduced to obtain low resistance Pt contacts to p-type GaN. The first step is performed after the mesa etching process using buffered oxide etch (BOE) and ammonium sulfide [(NH4)2Sx]. This is followed by the second step using BOE. The Pt contact, which was treated sequentially using ultrasonically boiled BOE (10 min) and boiled (NH4)2Sx (10 min), produces a specific contact resistance of 3.0 (±3.8)×10−5 Ωcm2. However, the contact, that was simply BOE-treated, yields 3.1 (±1.1)×10−2 Ωcm2. This indicates that the two-step surface treatment is promising technique for obtaining high quality ohmic contacts to p-GaN. Investigation of the electronic transport mechanisms using current-voltage-temperature (I-V-T) data indicates that thermionic field emission is dominant in the surface-treated Pt contacts.

Structure and composition of the ferroelectric Pb(Zr, Ti)O3 layers in a capacitor of the ferroelectric random-access memory (FeRAM) device having a density of 64 k were investigated by transmission electron microscopy (TEM) together with the energy-dispersive spectroscopy (EDS) technique. The 250 nm thick PZT layer derived by the sol-gel route showed a 2–3% Pb-deficient, 3–4% Ti-deficient, and 5–7% Zr-excess composition at the top electrode interface compared to the bulk composition when they were as-fabricated. The local compositional nonuniformity became more critical as the integration process proceeded, which seriously degraded the ferroelectric hysteresis and the device yield. The major cause of the compositional variation was the outward diffusion of Pb through the capping barrier TiO2 layer during annealing at 650 °C. The AlN capping barrier layer was also not effective in suppressing the diffusion of Pb. However, the Al2O3/TiO2 double capping layer was very effective in suppressing the outward diffusion of Pb, and excellent ferroelectric characteristic was expected.

Two-step surface-treatment is introduced to obtain low resistance Pt contacts to ptype GaN. The first step is performed after the mesa etching process using buffered oxide etch (BOE) and ammonium sulfide [(NH4)2Sx]. This is followed by the second step using BOE. The Pt contact, which was treated sequentially using ultrasonically boiled BOE (10 min) and boiled (NH4)2Sx (10 min), produces a specific contact resistance of 3.0 (±3.8)×10-5 Ωcm2. However, the contact, that was simply BOE-treated, yields 3.1 (±1.1)×10-2 Ωcm2. This indicates that the two-step surface treatment is promising technique for obtaining high quality ohmic contacts to p-GaN. Investigation of the electronic transport mechanisms using current-voltage-temperature (I-V-T) data indicates that thermionic field emission is dominant in the surface-treated Pt contacts.

A low resistance Ohmic contact to p-type GaN is essential for reliable operation of electronic and optoelectronic devices. Such contacts have been made using Ni/Au and Pd / Au contacts to p-type Mg-doped GaN (1.41×1017 cm−3) grown by metalorganic chemical vapor deposition ( MOCVD ) on ( 0001 ) sapphire substrates. Thermal evaporation was used for the deposition of those metals followed by annealing at temperatures of 400 ∼ 700 °C in an oxygen and nitrogen mixed gas ambient, then subsequently cooled in liquid nitrogen which reduced the specific contact resistance from the range of 9.46∼2.80×10−2 ωcm2 to 9.84∼2.65×10−4 ωcm2 for Ni/Au and from the range of 8.35∼5.01×10−4 ωcm2 to 3.34∼1.80×10−4 ωcm2 for Pd/Au. The electrical characteristics for the contacts were examined by the current versus voltage curves and the specific contact resistance was determined by use of the circular transmission line method (c-TLM). The effects of the cryogenic process on improving Ohmic behavior (I-V linearity) and reducing the specific contact resistance will be discussed from a microstructural analysis which reveals the metallurgy of Ohmic contact formation.

GaN epitaxial thin films were grown on a nitridated sapphire at low temperature (550°C) using remote plasma enhanced ultrahigh vacuum chemical vapor deposition system and these films were investigated by Rutherford backscattering spectroscopy (RBS), X-ray diffraction(XRD) θ-rocking technique and the Ultraviolet-Visible-Nearinfrared (UV-VIS-NIR) absorption spectrum. The FWHM of the X-ray θ-rocking curve was about 0.4 degree using the (0002) reflection from the GaN layer with 5000Å thickness grown on the nitridated sapphire. An analysis of XRD and the UV-VIS-NIR absorption spectrum showed that the crystalline and optical qualities of GaN are dependent on the nitridation time of the sapphire even at low temperature when a plasma source is used for nitridation. This means that the density of protrusion, which is formed by a relaxation of the elastic energy caused by the lattice difference between the sapphire and AlxO1-xN, with the sapphire nitridation time plays a key role in the crystalline and optical properties of grown GaN films. The RBS channeling data and the FWHM value of the θ-rocking curve for GaNr(0002) also indicated that the truncated hexagonals are tilted towards each other. These results showed that the GaN epitaxial film can be successfully grown on nitridated sapphire by RPE-UHVCVD even at low temperature.

We report a new Ni/Pt/Au (20/30/80 nm) metallization scheme to achieve a low ohmic contacts to p-type GaN with a carrier concentration of 9.4 × 1016 cm-3. A Mg-doped GaN layer (0.5 μm) was grown on (0001) sapphire substrate by metalorganic chemical vapor deposition (MOCVD). All metal thin films were deposited on the p-GaN layer in an electron-beam evaporation system. Samples were annealed by a rapid thermal annealing (RTA) process at a range of temperatures from 300 °C to 850 °C under a flowing Ar atmosphere. A circulartransmission line model (c-TLM) was employed to calculate the specific contact resistance, and current-voltage (I-V) data were measured with HP4155A. The Ni/Pt/Au contacts without the annealing process showed nearly rectifying characteristics. The ohmic contacts were formed on the samples annealed at 500 °C for 30 sec and the I-V data showed a linear behavior. The specific contact resistance was 2.1 × 10-2 Ωcm2. However with increasing the annealing temperature above 600 °C, ohmic contacts were again degraded. Auger electron spectroscopy (AES) depth profiles were used to investigate the interfacial reactions between the trilayer and GaN. AES results suggested that Pt plays a significant role in forming ohmic contact as an acceptor at the interface. Atomic force microscope (AFM) also showed that the samples with good ohmic contact have very smooth surface.

A remote plasma enhanced-ultrahigh vacuum chemical vapor deposition (RPE-UHVCVD) system equipped with a radio frequency-inductively coupled plasma (RF-ICP) which produces the reactive nitrogen species was employed to study the nitridation process at low temperature. The sapphire surface nitridated under various conditions was investigated with x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The nitridation process seems to be mostly affected by the RF power even at low temperature since the intensity of the N1s, peak was not dependent on the substrate temperature but on the RF power. The AFM images showed that the protrusion density on the sapphire surface decreased rapidly when the nitridation temperature was decreased. This result suggests that the formation of the protrusions is closely related to the process temperature, indicating that the formation of such protrusions is caused by the change of an elastic strain energy due to the thermal stress. It was possible to nitridate the sapphire surface without protrusion at a very low temperature. The crystallinity of GaN grown at 450 °C was found to be much improved when the sapphire substrate was nitridated at low temperature prior to the GaN layer growth.

This study investigated the low temperature growth of GaN on a nucleation layer in a remote plasma enhanced-ultrahigh vacuum chemical vapor deposition (RPE-UHVCVD) system which is equipped with an rf plasma cell for a nitrogen source. It was found that the growth temperature and the film thickness of the nucleation layer and the nitrogen flow rate for GaN growth play important roles in the improvement of crystallinity of the GaN layer. The nitridation of sapphire was also found to enhance the formation of facet shaped nuclei on the nucleation layer. As the temperature of the nucleation layer increased, islands with hexagonal and other facet shapes were formed on the grown GaN surface. This facet formation was related with the surface morphology and crystallinity of GaN. The best crystallinity was measured in a GaN layer with hexagonal facets on the surface and such GaN layers could be grown on a nucleation layer grown at 375 °C. Nitridation of sapphire and the growth temperature of the nucleation layer were also found to change the island shapes which enhances the formation of columnar structures in the GaN layer, resulting in the growth of a high crystalline GaN layer at low temperature.

The GaN formation on GaAs(100) using NH3 has been investigated using synchrotron radiation photoemission spectroscopy and an atomic force microscope (AFM). This study showed the effect of nitridation temperature on the compositional change, the chemical states, and the surface morphological changes in the nitridated surface layer. It was observed that ammonia is decomposed to an activated nitrogen atom above 700°C forming GaN on the surface. A thermally nitridated layer was composed of metallic Ga and GaN islands elongated along the [011] direction to relax the tensile strain in the [011] direction. As the nitridation temperature increased, the composition of GaN increased in the nitridated layer due to the efficient thermal decomposition of NH3 and the subsequent incorporation of the N atom to the metallic Ga. The surface morphology of the nitridated layer was also sensitive to the nitridation temperature and a smooth surface morphology could be obtained on the surface nitridated at 700°C.

Strip-shaped diamond-tip field emitter array was fabricated by using the transfer mold technique. The sharp turn-on characteristic was observed from the current-voltage measurement of the fabricated diamond-tip field emitter array. The turn-on characteristic of the diamond-tip field emitter array was compared with that of a flat diamond film. High emission current density was obtained from the diamond-tip field emitter array. The threshold voltage of the diamond-tip field emitter array was lower than that of a flat diamond film.

The surface structure of Si(111) post-annealed at 980 °C after nitrogen ion induced nitridation has been investigated by using a scanning tunneling microscope (STM) and low energy electron diffraction (LEED). The LEED and STM results indicated the formation of ordered domain of quadruplet structure in the silicon nitride layer. The LEED pattern taken from the nitrated Si(111) surface showed a coexistence of 7×7 domain with quadruplet one. In the STM image taken from the same surface, a three directional periodicity with a periodic arrangement of white protrusions was observed in the local area of silicon nitride island and its symmetry directions were rotated about 10° with respect to those of Si(111) surface. In addition to the quadruplet structure of the silicon nitride island, meta-stable structures such as 9×9, c(4×2), and 2×2 as well as 7×7 phase boundaries were observed to have been formed on the Si(111) surface during the rapid cooling of nitrated surface from the post-annealing temperature of 980 °C. The investigation of the surface structure of nitrated Si(111) showed that the surface nitrated at high temperature had better epitaxial silicon nitride layer than that post-annealed after nitridation at room temperature.