We studied the effect of extended defects on electrical characteristics of Si doped n-type nonpolar a-plane GaN films. The n-type GaN layers were grown on co-loaded reduced defect density sidewall lateral epitaxial overgrowth (SLEO) a-plane GaN templates and high defect density planar a-plane GaN templates by metalorganic chemical vapor deposition (MOCVD). The highest conductivity value was observed at the carrier concentration of 1.05 × 1019 cm−3 as 261.12 cm2/Vs for SLEO a-GaN and 106.77 cm2/Vs for the planar a-plane GaN samples. At the same doping level, the carrier compensation for SLEO samples was ∼12% less than planar samples.

The performance of conventional c-plane GaN-based optoelectronic devices suffers from the effects of strong polarization-induced electric fields along the conduction direction, which result in a reduced overlap between electron and hole wavefunctions. These devices consequently demonstrate low radiative recombination rates, and a blue-shift in peak emission wavelength with increasing bias. There have been several recent demonstrations of light emitting diodes (LEDs) fabricated on non-polar a- and m- plane GaN that show greatly reduced to zero blue-shift of peak emission wavelength, and other recent work on non-polar GaN has yielded hole concentrations that are almost an order of magnitude higher than for c-plane GaN.

The effects of the strong polarization-induced electric fields may, conceivably, also be mitigated or potentially eliminated by growing films on so-called ‘semipolar’ planes. A semipolar plane is any plane that may not be classified as a c-, a- or m- plane, and has at least two non-zero h, i, or k Miller indices and a nonzero l Miller index (, and planes, for example). It is expected that devices grown on these semipolar planes should also demonstrate a reduced blue-shift in peak emission wavelength and higher hole concentrations. Further, recent work also suggests that the indium incorporation efficiency for growth on semipolar planes is comparable to that for growth on the c-plane.

We demonstrate the first green InGaN/GaN LED grown on a planar semipolar GaN template. The LED structure is grown by metalorganic chemical vapor deposition (MOCVD), and the 20 μm-thick, specular and optically transparent template is grown by hydride vapor phase epitaxy (HVPE). The fabricated devices have a peak emission wavelength of ∼525 nm and demonstrate rectifying behavior, with a low turn-on voltage of 3.2 V. We observe a small ∼7 nm blue-shift in the peak emission wavelength during electroluminescence measurements, over the range 20 to 250 mA. We also see an almost linear increase in the output power from 5 mA to 200 mA, with no appreciable decrease in the external quantum efficiency over the same range. We also observe evidence of polarization anisotropy in the emission from the semipolar green LEDs.

Carbon doping of GaN is of great interest in part because it has been shown to result in semi-insulating (SI) behavior. However, determination of the bandgap states and hence the exact mechanism responsible for the SI behavior is, to date, an unresolved issue. A key impediment is that the presumed C acceptor levels are likely near the minority carrier (valence) bandedge of otherwise background n-type GaN, and hence their precise detection by usual methods is difficult. In this paper, we exploit the inherent ability of deep level optical spectroscopy (DLOS) to detect states near the minority carrier band edge, as well as potentially deep states associated with C in background n-type GaN. This is accomplished by comparing unintentionally doped (uid) GaN grown by atmospheric pressure (AP) MOCVD, which has residual n-type conductivity, with LP MOCVD GaN that incorporates a large concentration of C for both uid and intentionally Si co-doped conditions. The results show the emergence of a shallow state at Ec - 3.28 eV (Ev + 0.16 eV) for the LP samples with a minimum concentration of 3.6 × 1016 cm-3 that efficiently compensates Si donors for the co-doped sample, and results in semi-insulating behavior for the uid-LP sample. In contrast, this state is not observed for the AP GaN material, which incorporates a factor of ∼10 times less C, and instead only the expected residual Mg acceptor level at Ec - 3.22 eV is observed. Additionally, a state at Ec - 1.35 eV, near the theoretically expected C split-interstitial level in n-type GaN, is observed to increase significantly in concentration with increased C concentration.

The impact of growth temperature and Ga/N flux ratio on deep levels in GaN grown by molecular beam epitaxy (MBE) is systematically investigated using both deep level optical spectroscopy (DLOS) and deep level transient spectroscopy (DLTS) in a study designed to map out the presence and concentration of defects over a defined region of the MBE GaN growth phase diagram. A series of Si-doped GaN films were grown to cover a substrate temperature range and a Ga/N flux ratio range that spans from the N stable to the Ga droplet regimes along both variables. Identical growth templates were used to eliminate variations in dislocations between samples so that point defect variations could be tracked. For these samples, traps are detected at EC-Et=0.25, 0.60, 0.90, 1.35, 2.40, 3.04, and 3.28 eV. The near valence bands states at EC–3.04 and EC–3.28 eV are found to be strongly dependent on Ga/N flux with decreased concentrations as a function of increasing Ga flux toward the Ga droplet regime, but with little effect from growth temperature. The EC-1.35 eV level shows a strong dependence on growth temperature and only slight dependence on Ga/N flux ratio. In contrast, the concentration of the EC-Et=0.25, 0.90 eV levels increased with increasing Ga flux toward the Ga droplet regime, while the EC-Et=0.60 shows no dependence. The variation in concentration of the EC-2.40 eV level that has been related to VGa was difficult to quantify, but tends to increase towards nitrogen rich growth. The dependencies for the detected states with respect to growth temperature and Ga/N flux ratio suggest different physical point defect sources.

Optical properties of fully-strained wurtzite and zincblende InxGa1-xN/GaN multiple quantum well (MQW) structures were compared to discuss the origin of exciton localization. In contrast to the hexagonal InGaN MQWs, the photoluminescence (PL) peak energy of cubic InGaN MQWs showed a moderate blueshift with decreasing well thickness, L, and low-temperature PL decay time of the cubic MQWs did not depend strongly on L. The results imply that the wavefunction overlap in cubic InGaN MQWs was not reduced compared to the hexagonal ones, since they do not suffer from the electric field normal to the QW plane due either to spontaneous or piezoelectric polarization. Both MQWs exhibited a large and composition-dependent bandgap bowing, and time-resolved PL (TR-PL) signals showed a stretched-exponential decay even at room temperature. The exciton localization is considered to be an intrinsic property of InGaN.

InGaN multi-quantum-well laser diodes have been fabricated on fully-coalesced laterally epitaxially overgrown (LEO) GaN on sapphire. The laterally overgrown ‘wing’ regions as well as the coalescence fronts contained few or no threading dislocations. Laser diodes fabricated on the low-dislocation-density wing regions showed a reduction in threshold current density from 8 kA/cm2 to 3.7 kA/cm2 compared the those on the high-dislocation ‘window’ regions. Laser diodes also showed a two-fold reduction in threshold current density when comparing those on the wing regions to those fabricated on conventional planar GaN on sapphire. The internal quantum efficiency also improved from 3% for laser diodes on conventional GaN on sapphire to 22% for laser diodes on LEO GaN on sapphire.

The effect of In on the structural and optical properties of InxGa1−xN/GaN multiple quantum wells (MQWs) was investigated. These were five-period MQWs grown on sapphire by metalorganic chemical vapor deposition. Increasing the In composition caused broadening of the high-resolution x-ray diffraction superlattice satellite peak and the photoluminescence-excitation bandedge. This indicates that the higher In content degrades the interface quality because of nonuniform In incorporation into the GaN layer. However, the samples with higher In compositions have lower room temperature (RT) stimulated (SE) threshold densities and lower nonradiative recombination rates. The lower RT SE threshold densities of the higher In samples show that the suppression of nonradiative recombination by In overcomes the drawback of greater interface imperfection.

An AlxGa1−xN/GaN two-dimensional electron gas structure with x = 0.13 deposited by molecular beam epitaxy on a GaN layer grown by organometallic vapor phase epitaxy on a sapphire substrate was characterized. Hall effect measurements gave a sheet electron concentration of 5.1×1012 cm−2 and a mobility of 1.9 × 104 cm2/Vs at 10 K. Mobility spectrum analysis showed single-carrier transport and negligible parallel conduction at low temperatures. The sheet carrier concentrations determined from Shubnikov-de Haas magnetoresistance oscillations were in good agreement with the Hall data. The electron effective mass was determined to be 0.215±0.006 m0 based on the temperature dependence of the amplitude of Shubnikov-de Haas oscillations. The quantum lifetime was about one-fifth of the transport lifetime of 2.3 × 10−12 s.

Junction field effect transistors (JFET) were fabricated on a GaN epitaxial structure grown by metal organic chemical vapor deposition. The DC and microwave characteristics, as well as the high temperature performance of the devices were studied. These devices exhibited excellent pinch-off and a breakdown voltage that agreed with theoretical predictions. An extrinsic transconductance (gm) of 48 mS/mm was obtained with a maximum drain current (ID) of 270 mA/mm. The microwave measurement showed an fT of 6 GHz and an fmax of 12 GHz. Both the ID and the gm were found to decrease with increasing temperature, possibly due to lower electron mobility at elevated temperatures. These JFETs exhibited a significant current reduction after a high drain bias was applied, which was attributed to a partially depleted channel caused by trapped electrons in the semi-insulating GaN buffer layer.

We have studied an influence of pressure on the emission and absorption spectra measured from various types of InGaN structures such as epilayers, quantum wells and quantum dots. While the known pressure coefficients of GaN and InN bandgaps are in the range 40-25 meV/GPa, the experimental observation for the light emission shift with pressure for InGaN alloys is dramatically different. With the increasing In content and thus decreasing emission energy the observed pressure coefficients become very small eventually reaching zero or even slightly negative values! We have observed a much weaker trend for the decrease of the pressure coefficient for the absorption edges of InGaN. First principle calculations of InGaN band structure and its modification with a pressure are not able to explain the huge effect observed in the emission experiment but are in a good agreement with the results obtained in optical absorption measurements. We discuss here the possible mechanisms which can account for extremely low pressure coefficient of the light emission and the discrepancy between sensitivity light emission and absorption on applied pressure in InGaN alloys.

The deep level spectra in both p+-n homojunction and n-type Schottky GaN diodes are studied by deep level transient spectroscopy (DLTS) in order to compare the role of the junction configuration on the defects found within the n-GaN layer. Both majority and minority carrier DLTS measurements are performed on the diodes allowing the observation of both electron and hole traps in n-GaN. An electron level at Ec−Et=0.58 and 0.62 V is observed in the p+-n and Schottky diodes, respectively, with a concentration of ∼3−4×1014 cm−3 and a capture cross section of ∼1−5×10−15 cm2. The similar Arrhenius behavior indicates that both emissions are related to the same defect. The shift in activation energy is correlated to the electric field enhanced-emission in the p+-n diode, where the junction barrier is much larger. The p+-n diode configuration allows the observation of a hole trap at Et−Ev=0.87 eV in the n-GaN which is very likely related to the yellow luminescence band.

The polarity of laterally epitaxially overgrown (LEO) GaN on Si(111) with an AlN buffer layer grown by MOCVD has been studied by convergent beam electron diffraction (CBED). The LEO GaN was studied by cross-section and plan-view transmission electron microscopy (TEM). The threading dislocation density is less than 108 cm−2 and no inversion domains were observed. CBED patterns were obtained at 200 kV for the <1 00> zone. Simulation was done by many-beam solution with 33 zero-order beams. The comparison of experimental CBED patterns and simulated patterns indicates that the polarity of GaN on Si(111) is Ga face.

Temperature-variable Hall and Shubnikov- de Haas effects have been used to study persistent photoconductivity in an AlGaN/GaN heterojunction. At liquid helium temperatures, the mobility in this structure was close to 55000 cm2/Vs. A blue GaN-based light emitting diode was used to illuminate the sample. This illumination resulted in a persistent photocurrent, which allowed us to vary the carrier density and study the dependence of the mobility on the carrier concentration. Exposing the sample to this light resulted in an increase in the carrier density. For small increases in the density, the mobility also increased. However, unlike in previous reports by other authors, extended illumination resulted in an increase in the density and a decrease in the mobility. The initial increase in the mobility is attributed to increased screening due to the increase in the carrier density, while the decrease in the mobility may be attributed to alloy scattering.

AlGaN/GaN strained layer superlattices have been employed in the cladding layers of InGaN multi-quantum well laser diodes grown by metalorganic chemical vapor deposition (MOCVD). Superlattices have been investigated for strain relief of the cladding layer, as well as an enhanced hole concentration, which is more than ten times the value obtained for bulk AlGaN films. Laser diodes with strained layer superlattices as cladding layers were shown to have superior structural and electrical properties compared to laser diodes with bulk AlGaN cladding layers. As the period of the strained layer superlattices is decreased, the threshold voltage, as well as the threshold current density, is decreased. The resistance to vertical conduction through p-type superlattices with increasing superlattice period is not offset by the increase in hole concentration for increasing superlattice spacing, resulting in higher voltages.

We report the results of nondegenerate optical pump-probe absorption experiments performed on GaN and InGaN thin films and quantum wells under the conditions of strong optical band to band excitation. The evolution of the band edge in these materials was monitored as the number of photoexcited free carriers was increased beyond that required to achieve population inversion and observe stimulated emission. The band edge of InGaN is shown to exhibit markedly different high excitation behavior than that of GaN, explaining in part the reduction in stimulated emission threshold that typically accompanies the incorporation of indium into GaN to form InGaN. A comparison of the band edge absorption changes observed in pump-probe experiments to the gain spectra measured in variable-stripe gain experiments is also given.

We have systematically studied the influence of Si doping on the optical characteristics of InGaN/GaN multiple quantum wells (MQWs) using photoluminescence (PL), PL excitation (PLE), and time-resolved PL spectroscopy combined with studies of optically pumped stimulated emission and structural properties from these materials. The MQWs were grown on 1.8-μm-thick GaN layers on c-plane sapphire films by metalorganic chemical vapor deposition. The structures consisted of 12 MQWs with 3-nm-thick InGaN wells, 4.5-nm-thick GaN barriers, and a 0.1-μm-thick Al0.07Ga0.93N capping layer. The Si doping level in the GaN barriers was varied from 1 × 1017 to 3 × 1019 cm−3. PL and PLE measurements show a decrease in the Stokes shift with increasing Si doping concentration. The 10 K radiative recombination lifetime was observed to decrease with increasing Si doping concentration (n), from ∼ 30 ns (for n < 1 × 1017 cm−3) to ∼ 4 ns (for n = 3 × 1019 cm−3). To elucidate whether non-radiative recombination processes affect the measured lifetime, the temperature-dependence of the measured lifetime was investigated. The reduced Stokes shift, the decrease in radiative recombination lifetime, and the increase in structural and interface quality with increasing Si doping indicate that the incorporation of Si in the GaN barriers results in a decrease in carrier localization at potential fluctuations in the InGaN active regions and the interfaces.

The polarity of laterally epitaxially overgrown (LEO) GaN on Si(111) with an AlN buffer layer grown by MOCVD has been studied by convergent beam electron diffraction (CBED). The LEO GaN was studied by cross-section and plan-view transmission electron microscopy (TEM). The threading dislocation density is less than 108cm−2 and no inversion domains were observed. CBED patterns were obtained at 200 kV for the <1100> zone. Simulation was done by many-beam solution with 33 zero-order beams. The comparison of experimental CBED patterns and simulated patterns indicates that the polarity of GaN on Si(111) is Ga face.

Vapor-phase processes such as chemical vapor deposition (CVD) and reactive ion etching are the primary methods for the production-scale synthesis and processing of many high-quality thin-film materials. For example, these processes are widely used in the microelectronics industry for synthesis and lithography of the various semiconducting, insulating, and conducting layers in devices. Understanding the means of controlling the microstructure and composition of these materials is of great technological interest. However a difficulty often encountered in developing vapor-phase processes is an undesirable dependence on trial-and-error methods for optimizing the many process parameters. These parameters include gas composition, flow rate, pressure, and substrate temperature, all of which are typically changing with time. This reliance on empirical methods can be attributed to the tremendous chemical and physical complexity of vapor-phase processes and the lack of appropriate in situ measurement techniques for the vapor-phase environment.

We have initiated a program to apply synchrotron x-ray analysis techniques as real-time probes of film and surface structure during vapor-phase processing. X-rays have a combination of properties which makes them particularly well-suited for these studies. Unlike electrons, x-rays have a sufficiently low absorption to penetrate vapor-phase processing environments and chamber walls. Unlike visible light, x-rays have wavelengths and energies suitable for study of atomic-scale structure and chemistry. A growing number of in situ synchrotron x-ray investigations of film growth and processing demonstrate the power of these techniques.

The effect of In on the structural and optical properties of InxGa1−xN/GaN multiple quantum wells (MQWs) was investigated. These were five-period MQWs grown on sapphire by metalorganic chemical vapor deposition. Increasing the In composition caused broadening of the high-resolution x-ray diffraction superlattice satellite peak and the photoluminescence-excitation bandedge. This indicates that the higher In content degrades the interface quality because of nonuniform In incorporation into the GaN layer. However, the samples with higher In compositions have lower room temperature (RT) stimulated (SE) threshold densities and lower nonradiative recombination rates. The lower RT SE threshold densities of the higher In samples show that the suppression of nonradiative recombination by In overcomes the drawback of greater interface imperfection.

We demonstrate a technique of lateral epitaxial overgrowth (LEO) of GaN, termed 'maskless' LEO, in which no mask is deposited prior to LEO regrowth. Instead, a bulk (> 2 μm) GaN layer on sapphire is selectively dry etched, leaving ∼5 μm-wide stripe mesas oriented in the <1010>GaN direction, with a 20 μm period. These stripes serve as seeds for LEO GaN growth, which proceeds from the tops of the stripes and expands laterally, resulting in a ‘T’, or overhang, morphology. As for LEO over an SiO2 mask, significant defect reduction (from ∼109 cm−2 to ∼106 cm−2 ) is observed in cross-sectional transmission electron microscopy (TEM). Atomic force microscopy of the top surface of the LEO GaN reveals that no threading dislocations with screw component terminate at the surfaces of laterally overgrown regions. X-ray diffraction measurements reveal that the wings exhibit a crystallographic tilt away from the seed regions in an azimuth perpendicular to the stripe direction; the tilt angle (∼0.4 – 0.5°) is relatively independent of growth temperature and wing aspect ratio.