The effects of source field plates on AlGaN/GaN High Electron Mobility Transistor reliability under off-state stress conditions were investigated using step-stress cycling. The source field plate enhanced the drain breakdown voltage from 55V to 155V and the critical voltage for off-state gate stress from 40V to 65V, relative to devices without the field plate. Transmission electron microscopy was used to examine the degradation of the gate contacts. The presence of cracking that appeared on both source and drain side of the gate edges was attributed to the inverse piezoelectric effect. In addition, a thin oxide layer was observed between the Ni gate contact and the AlGaN layer, and both Ni and oxygen had diffused into the AlGaN layer. The critical degradation voltage of AlGaN/GaN High Electron Mobility Transistors during off-state electrical stress was determined as a function of Ni/Au gate dimensions (0.1-0.17μm). Devices with different gate length and gate-drain distances were found to exhibit the onset of degradation at different source-drain biases but similar electric field strengths, showing that the degradation mechanism is primarily field-driven. The temperature dependence of sub-threshold drain current versus gate voltage at a constant drain bias voltage were used to determine the trap densities in AlGaN/GaN high electron mobility transistors (HEMTs) before and after the off-state stress. Two different trap densities were obtained for the measurements conducted at 300-493K and 493-573K, respectively.

By pumping AlGaN/GaN HEMTs with below band-gap light we observe changes in drain current that correspond to the trapping and detrapping of carriers within the band-gap. These changes in drain current are indicators of trap density, since the energy from a specific wavelength of light pumps traps whose activation energies are less than or equal to that of the light source.

AlGaN/GaN HEMTs on SiC with dual submicron gates with widths of 125nm, 140nm, or 170nm, are DC-stressed under three different conditions along a load line: VGS=0, VDS=5 (on-state), VGS=-2, VDS=9.2 and, VGS=-6, VDS=25 (off-state). The stress tests are interrupted at 20% degradation and the optically pumped comparisons to the baseline are measured.

This paper describes the optical pumping technique and results from experiments of AlGaN/GaN HEMTs under the three DC stress biases along a load line.

AlGaN/GaN high electron mobility transistors (HEMTs) with a polarized Polyvinylidene difluoride (PVDF) film coated on the gate area exhibited significant changes in channel conductance upon exposure to different ambient pressures. The PVDF thin film was deposited on the gate region with an inkjet plotter. Next, the PDVF film was polarized with an electrode located 2 mm above the PVDF film at a bias voltage of 10 kV and 70 °C. Variations in ambient pressure induced changes in the charge in the polarized PVDF, leading to a change of surface charges on the gate region of the HEMT. Changes in the gate charge were amplified through the modulation of the drain current in the HEMT. By reversing the polarity of the polarized PVDF film, the drain current dependence on the pressure could be reversed. Our results indicate that HEMTs have potential for use as pressure sensors.

Chloride ion concentration can be used as a biomarker for the level of pollen exposure in allergic asthma, chronic cough and airway acidification related to respiratory disease. AlGaN/GaN high electron mobility transistor (HEMT) with an InN thin film in the gate region was used for real time detection of chloride ion detection. The InN thin film provided surface sites for reversible anion coordination. The sensor exhibited significant changes in channel conductance upon exposure to various concentrations of NaCl solutions. The sensor was tested over the range of 100 nM to 100 μM NaCl solutions. The effect of cations on the chloride ion detection was also studied.

Antibody-functionalized, Au-gated AlGaN/GaN high electron mobility transistors (HEMTs) were used to detect Perkinsus marinus. The antibody was anchored to the gate area through immobilized thioglycolic acid. The AlGaN/GaN HEMT were grown by a molecular beam epitaxy system (MBE) on sapphire substrates. Infected sea waters were taken from the tanks in which Tridacna crocea infected with P. marinus were living and dead. The AlGaN/GaN HEMT showed a rapid response of drain-source current in less than 5 seconds when the infected sea waters were added to the antibody-immobilized surface. The recyclability of the sensors with wash buffers between measurements was also explored. These results clearly demonstrate the promise of field-deployable electronic biological sensors based on AlGaN/GaN HEMTs for Perkinsus marinus detection.

Single phase GaGdN and GaGdN:Si films were grown on sapphire substrates. The undoped films were highly resistive films but became conductive with the addition of Si. SQUID magnetometry indicated room temperature ferromagnetism in both types of materials. Structural defects had a strong influence on the magnetic ordering of the material, as seen in a drastic reduction of magnetic moment with degrading crystalline quality. Magnetization of the co-doped film increased with Si content, reaching levels higher than that of the undoped material. Gd-doped AlN films grown in a similar fashion also displayed Curie temperatures above room temperature.

Effects of 10 MeV electron and fast reactor neutron irradiations on carrier removal rate and deep traps spectra were compared for undoped n-GaN samples. It is shown that for electron irradiation the carrier removal rate is well accounted for by the difference in introduction rates of nitrogen-vacancy-related donors with activation energy 0.2 eV and of nitrogen-interstitial-related acceptors at Ec-1.2 eV. In the case of neutron irradiation the introduction rate of all deep traps was much lower than the carrier removal rate indicating that the main contribution to electron removal was due to disordered regions. These regions give rise to a marked persistent photocapacitance signal and a hole-trap-like feature in deep traps spectra. The Fermi level position in the core of disordered regions is located near Ec-(0.85-1) eV.

Films of MgO and MgCaO ternaries were grown at low temperature as dielectrics on 6H-SiC by gas-source MBE. MgO grown at 300 and 400°C revealed crystallites textured toward the (111) orientation on SiC (0001). A solid-solution Mg.75Ca.25O ternary was grown having a minimal lattice mismatch and low root mean square (RMS) roughness of 0.5 nm. SiC pretreatments in UV-ozone reduced carbon contaminants on the surface of SiC, but resulted in the increase of fixed oxide charge in the oxide/SiC interface. Electrical breakdown fields >3.5 MV cm-1 and low density of interface states on the order of 1011 cm-2eV-1 were achieved for a Mg.75Ca.25O ternary grown at 300°C. These oxides are presented for the first time as low temperature alternatives to SiO2 gate dielectrics for SiC MOS applications.

The development of reliable and thermally stable Ohmic and Schottky contacts to ZnO is one of the critical issues related to the fabrication of ZnO-based UV light emitters/detectors and field effect transistors. To date, a number of different metallization schemes and surface cleaning procedures prior to metal deposition have been examined for rectifying contacts on n-ZnO. While these reports have shown that low reactive metals such as Au, Ag and Pd form rectifying contacts with Schottky barrier heights in the 0.6-0.8 eV range, the thermal stability of these contacts is usually extremely poor, with degradation occurring even at 60°C for Au/n-ZnO. One approach to achieving increased barrier heights that has proven successful for GaAs, InP, InGaAs and other compound semiconductors is the use of cryogenic deposition temperatures. In this context, we report in this work on the effect of cryogenic temperature metal deposition on the contact properties of Pd, Pt, Ti, and Ni on single-crystal n-type ZnO. Deposition at both room and low temperature produced contacts with Ohmic characteristics for Ti and Ni metallizations. In comparison, both Pd and Pt contacts showed rectifying characteristics after deposition. All rectifying contacts exhibited barrier heights around 1-2 eV and idealities between 1 and 2. Low temperature deposition gave higher resistances in comparison to room temperature deposition for all cases. Larger contacts also corresponded to an increase in resistance. Changes in contact behavior were measured on Pd to anneal temperatures of ∼300°C, showing an increase in barrier height along with a decrease in ideality with increasing temperature. This difference with annealing temperature is in sharp contrast to previous results for Au contacts to ZnO. There were no differences in near-surface stoichiometry for the different deposition temperatures; however low temperature contacts demonstrated some cracking in Pt and Pd, probably due to surface stress.

GaN and AlN thin films were implanted with gadolinium (Gd)atoms and characterized using deep ultra-violet (UV) photoluminescence(PL). The Gd-implanted samples were annealed at temperatures up to 1178K in a flowing N2 gas to facilitate recovery of implantation-related damage. Using the output at 195 nm from a quadrupled Ti:sapphire laser, narrow PL emission was observed at 318 nm from the Gd- implanted AlN thin films. This emission is characteristic of the lowest energy 4f transition of the trivalent Gd ion. A boarder emission band, also centered at 318 nm, was observed under excitation at 266 nm. No PL emission was observed from the Gd-implanted GaN thin films at either the bandedge or due to a 4f transition. The dependence of the UV emission on AlN sample temperature was systematically studied. The peak PL emission intensity decreased by less that a factor of 3 over the temperature range of 10 K to 300 K. Decay transients of the UV emission were measured indicating that the lifetime of this emission is very fast.

Au-gated AlGaN/GaN High Electron Mobility Transistor (HEMT) structures were functionalized in the gate region with label free 3′-thiol modified oligonucleotides. This serves as a binding layer to the AlGaN surface for hybridization of matched target Deoxyribonucleic Acid (DNA). X-ray photoelectron spectroscopy (XPS) shows that immobilization of thiol modified DNA covalently bonded with gold on the gated region. Hybridization between probe DNA and matched or mismatched target DNA on the Au-gated HEMT was detected by electrical measurements. The HEMT drain-source current showed a clear decrease of 115 μA as this matched target DNA was introduced to the probe DNA on the surface, showing the promise of the DNA sequence detection approach for biological sensing.

The development of new etching and contact metallurgies for the ZnO/ZnMgO/ZnCdO materials system and various approaches for realizing ZnO LEDs are reviewed. ZnO nanorod MOSFETs and pH sensors have been demonstrated. In addition, selective detection of hydrogen with Pt-coated single ZnO nanorods is discussed discussed. The Pt-coated single nanorods show a current response approximately a factor of three larger at room temperature upon exposure to 500ppm H2 in N2 than thin films of ZnO. The power consumption of these sensors can be very small (in the nW range) when using discontinuous coatings of Pt. Once the Pt coating becomes continuous, the current required to operate the sensors increases to the μW range. The ZnO nanorods are insensitive to oxygen in the measurement ambient.

A novel metallization scheme for Ohmic contact (Ti/Al/ W2B /Ti/Au) to n-GaN using high temperature boride was studied using contact resistance, scanning electron microscopy and Auger Electron Spectroscopy measurements. A minimum contact resistance of 7×10-6 Ω.cm2 was achieved for W2B based scheme at an annealing temperature of 800 °C. Contact resistances were found to be essentially independent of measurement temperature, indicating that tunneling plays a dominant role in the current transport. The outdiffusion of Ti to the surface at temperatures of ∼500°C, and at 800°C the onset of intermixing of Al within the contact was found to occur. By 1000°C, the contact showed a reacted appearance and AES showed almost complete intermixing of the metallization. The reliability measurements for the contact resistance of W2B based contact showed excellent stability for extended periods at 200°C, which simulates the type of device operating temperature that might be expected for operation of GaN-based power electronic devices.

This paper reviews of some of the progress made in the development of ZnO-based light emitting diodes (LEDs). n-ZnO/p-AlGaN-based heterostructures have been successfully for the fabrication of UV emitting LEDs that have operated at temperatures up to 650K, suggesting an excitonic origin for the optical transitions. RF-plasma-assisted molecular beam epitaxy has been used to grow epitaxial CdxZn1-xO films on GaN/sapphire structure. These films have a single-crystal wurtzite structure as demonstrated by structural and compositional analysis. High quality CdxZn1-xO films were grown with up to x=0.78 mole fraction as determined by RBS and SIMS techniques. Optical emission ranging from purple (Cd0.05Zn0.95O) to yellow (Cd0.29Zn0.71O) was observed. Compositional fluctuations in a Cd0.16Zn0.84O films were not detected by spatially resolved CL measurements, although intensity fluctuation with features of ∼0.5 μm diameter were seen on the intensity maps. Time resolved photoluminescence shows multi-exponential decay with 21 psec. and 49±3 psec. lifetimes, suggesting that composition micro-fluctuations may be present in Cd0.16Zn0.84O film.

ZnO thin films have been epitaxially grown on r-plane sapphire by RF-plasma-assisted molecular beam epitaxy. X-ray diffraction (XRD) and transmission electron microscopy (TEM) studies indicate that the epitaxial relationship between ZnO and r-plane sapphire is (1120)ZnO // (1102)sapphire and [0001]ZnO // [1101]sapphire. Atomic force microscopy measurements reveal islands extended along the sapphire [1101] direction. XRD omega rocking curves for the ZnO (1120) reflection measured either parallel or perpendicular to the island direction suggest the defect density anisotropy along these directions. Due to the small lattice mismatch along the ZnO [0001] direction, few misfit dislocations were observed at the ZnO/Al2O3 interface in the high-resolution cross-sectional TEM image with the zone axis along the ZnO [1100] direction.

Single ZnO nanowire metal-oxide semiconductor field effect transistors (MOSFETs) were fabricated using nanowires grown by site selective Molecular Beam Epitaxy. When measured in the dark at 25°C, the depletion-mode transistors exhibit good saturation behavior, a threshold voltage of ∼-3V and a maximum transconductance of order 0.3 mS/mm. Under ultra-violet (366nm) illumination, the drain-source current increase by approximately a factor of 5 and the maximum transconductance is ∼ 5 mS/mm. The channel mobility is estimated to be ∼3 cm2 /V.s, which is comparable to that reported for thin film ZnO enhancement mode MOSFETs and the on/off ratio was ∼25 in the dark and ∼125 under UV illumination.

ZnO is a very promising material for spintronics applications, with many groups reporting room temperature ferromagnetism in films doped with transition metals during growth or by ion implantation. In films doped with Mn during PLD, we find an inverse correlation between magnetization and electron density as controlled by Sn doping. The saturation magnetization and coercivity of the implanted single-phase films were both strong functions of the initial anneal temperature, suggesting that carrier concentration alone cannot account for the magnetic properties of ZnO:Mn and factors such as crystalline quality and residual defects play a role. Plausible mechanisms for the ferromagnetism include the bound magnetic polaron model or exchange is mediated by carriers in a spin-split impurity band derived from extended donor orbitals. We will also review progress in ZnO nanowires. The large surface area of nanorods makes them attractive for gas and chemical sensing, and the ability to control their nucleation sites makes them candidates for micro-lasers or memory arrays. Single ZnO nanowire depletion-mode metal-oxide semiconductor field effect transistors exhibit good saturation behavior, threshold voltage of ∼-3V and a maximum transconductance of 0.3 mS/mm. Under UV illumination, the drain-source current increased by approximately a factor of 5 and the maximum transconductance was ∼ 5 mS/mm. The channel mobility is estimated to be ∼3 cm2 /V.s, comparable to that for thin film ZnO enhancement mode MOSFETs and the on/off ratio was ∼25 in the dark and ∼125 under UV illumination. Pt Schottky diodes exhibit excellent ideality factors of 1.1 at 25 °C, very low reverse currents and a strong photoresponse, with only a minor component with long decay times thought to originate from surface states. In the temperature range from 25–150 °C, the resistivity of nanorods treated in H2 at 400 °C prior to measurement showed an activation energy of 0.089 eV and was insensitive to the ambient used. By contrast, the conductivity of nanorods not treated in H2 was sensitive to trace concentrations of gases in the measurement ambient even at room temperature, demonstrating their potential as gas sensors. We have also made sensitive pH sensors using single ZnO nanowires.

Both MgO and Sc2O3 are shown to provide low interface state densities (in the 1011 eV-1 cm-2 range) on n- and p-GaN, making them useful for surface passivation layers to mitigate current collapse in GaN/AlGaN high electron mobility transistors(HEMTs) and also gate dielectrics for metal-oxide semiconductor(MOS) devices. Clear evidence of inversion has been demonstrated in gate-controlled MOS p-GaN diodes using both types of oxide. Charge pumping measurements on diodes undergoing a high temperature implant activation anneal show a total surface state density of ∼3 × 1012 cm-2. On HEMT structures, both oxides provide effective passivation of surface states and these devices show improved output power. The MgO/GaN diodes and Sc2O3 passivated HEMT are also found to be quite radiation-resistant, making them attractive for satellite and terrestrial communication systems requiring a high tolerance to high energy(40MeV) protons.

High quality undoped AlGaN/GaN high electron mobility transistors(HEMTs) structures have been gorwn by Hydride Vapor Phase Epitaxy (HVPE). The morphology of the films grown on Al2O3 substrates is excellent with root-mean-square roughness of ∼0.2nm over 10×10μm2 measurement area. Capacitance-voltage measurements show formation of dense sheet of charge at the AlGaN/GaN interface. HEMTs with 1μm gate length fabricated on these structures show transconductances in excess of 110 mS/mm and drain-source current above 0.6A/mm. Gate lag measurements show similar current collapse characteristics to HEMTs fabricated in MBE- or MOCVD grown material.

Existing semiconductor electronic and photonic devices utilize the charge on electrons and holes in order to perform their specific functionality such as signal processing or light emission. The relatively new field of semiconductor spintronics seeks, in addition, to exploit the spin of charge carriers in new generations of transistors, lasers and integrated magnetic sensors. The ability to control of spin injection, transport and detection leads to the potential for new classes of ultra-low power, high speed memory, logic and photonic devices. The utility of such devices depends on the availability of materials with practical (>300K) magnetic ordering temperatures. In this paper, we summarize recent progress in dilute magnetic semiconductors such as (Ga,Mn)N, (Ga,Mn)P and (Zn,Mn)O exhibiting room temperature ferromagnetism, the origins of the magnetism and its potential applications in novel devices such as spin-polarized light emitters and spin field effect transistors.