We propose embedded microsensors to investigate the mechanical stress in copper damascene lines in a standard CMOS microelectronic technology. Those sensors are based on silicon piezoresistive effect where strain in the active silicon is induced by orientated copper lines. The challenge is to correlate the electrical sensors signal directly to stress variation in lines.
We have performed electrical measurements of the structures as a function of temperature. A coupled analytical and Finite Element thermomechanical Model of the structure was developed and a good agreement with measurements was obtained.