Soft transient electronics of polymeric substrates and silver-ink electronics are studied for correlated mechanical-electrical properties. Experimental and predictive finite element analysis are used to understand, explain and predict delamination, cracking, buckling, and failure of printed conductive components of such systems. An active transient polymer system consisting of poly(vinyl alcohol) and sodium bicarbonate is introduced that results in byproducts (alkaline and bubbles) when undergoing transiency. These byproducts are facilitated to control and expedite transiency of the electronic components based on redispersion of metallic nano/micro materials. Complete mechanical and electrical characterization of such systems is reported.