This paper reports the fabrication and characterization of micromachined ultrasonic transducers (MUT) based on piezoelectric aluminum nitride (AlN) thin films. The MUT device is composed of an Al/AlN/Al sandwiched structure overlaid on top of a silicon (Si) diaphragm. X-ray diffraction (XRD) scan shows that highly c-axis oriented AlN (002) thin films have been grown on Al/Si(100) substrates. Electrical impedance of the MUT devices is analyzed as a function of frequency. The fundamental resonant frequencies of the devices are found in the range of 65-70 kHz, which are in approximation to the theoretical calculation. The effective coupling factors of the devices are also derived as 0.18.

In this paper, various types of defects (both threading dislocation and misfit dislocations) in strained Si (sSi) have been analyzed by transmission electron microscopy (TEM). Germanium upper-diffusion has been studied by scanning transmission electron microscopy (STEM) for strained Si on SiGe/SOI. SGOI-devices processed using an optimized thermal budget show minimal Ge diffusion and minimal process related defects. Correlation between the device performance (such as leakage current and reliability) and structural information found in TEM has been established.

SiGe/SOI films have been investigated by transmission electron microscopy (TEM), atomic force microscopy (AFM) and Raman spectroscopy. For low Ge composition (∼ 20%), strain relaxation in the SiGe layer is minimal (<0.25%). For higher Ge content (32%), the tensile strain in a Si capping layer grown on top of SiGe/SOI is 0.46% (a stress of 0.81 GPa). TEM has revealed that most of the resulting defects at the SiGe/SOI interface and move downward. The misfit dislocation (MD) linear density is 17/μm, being consistent with the strain relaxation of the SiGe layer as determined by Raman spectroscopy. Upon thermal annealing, residual strain in the SiGe films has been further relaxed via two major routes (a) introduction of more MDs, and (b) development of surface undulation. High strain relaxation has been achieved in a SiGe layer grown on a higher-Ge content buffer layer.

The SiGe:C hetero-structure bipolar transistor (HBT) has turned into a key technology for wireless communication. This paper describes the metrology tools for SiGe epitaxy process control. Two types of analysis are critical, (1) routine control of SiGe base and Si cap thicknesses, location and thickness of the doping layer, doping dose, Ge composition profile, and their uniformity across the wafer; and (2) root-cause analysis on non-routine problems. This is achieved by developing a transmission electron microscopy (TEM) technique allowing a thickness measurement with a reproducibility better than 3 Å. Charge-compensated low-energy secondary ion mass spectrometry (SIMS) using an optical conductivity enhancement (OCE) allows a Ge composition measurement to a required precision of 0.5 at. %.

As the CMOS device dimensions continue to shrink, it is more and more critical to control the process parameters during mass production of advanced VLSI chips in order to achieve high yield and profitability. 2D dopant characterization is one of the critical techniques to resolve manufacturing excursions. A quick access to dopant distribution, especially precise delineation of p-n junction would readily provide critical information for many manufacturing issues, as well as device design and process development. Here we present our approaches to some of those issues with available techniques. The main techniques we used are dopant selective etching (DSE) and scanning probe microscopy based electrical measurements including scanning capacitance microscopy (SCM) and scanning spread resistance microscopy (SSRM). These techniques provided complementary results and showed strengths in solving different issues. We have successfully delineated junction of CMOS devices with 0.13 μm technology with source/drain extensions. Other applications, including diode leakage, well-well isolation, and buried layer delineation with the combination of these methods are presented.