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Integration of the III–V channel MISFETs on the Si platform is a potential solution to realize performance improvement and power reduction in the sub-22 nm node and beyond. To take advantage of the high electron mobility of III-Vs, the MIS interfaces of high integrity should be developed. This paper reports how the MIS characteristics vary in response to the changes in the interface composition and structures, and discusses the physics and chemistry behind these observations. We fabricated a wide variety of the high-k/III–V interface structures by employing the state-of-the-art technologies of the epitaxial wafers by MOCVD, surface reconstruction control in the MBE environment, wet/dry surface treatments optimized by utilizing XPS/AES analyses, and deposition of quality dielectrics (Al2O3, HfO2) by ALD and EB evaporation. The MIS characteristics were evaluated in the capacitor and FET structures. The talk will include the following topics: the effects of the cation composition (Al, Ga, In) of the III-V bulk on the MIS characteristics , the importance of the anion control (N, S) at the interface to improve the MIS characteristics, and the surface orientation ((100) vs. (111)) as a new parameter in the III-V MIS device design . This work was carried out in the Nanoelectronics Project supported by NEDO/METI.  T. Yasuda et al., as discussed at 39th IEEE SISC (San Diego, Dec. 2008).
We have investigated the initial oxynitridation of an atomically flat Si(001)-2×l surface by NO. We found that appropriate oxynitridation conditions, in which oxide decomposition does not occur, are required to suppress the roughness of the NO-reacted Si surface. Under these conditions, we investigated the growth behavior and chemical structure. The first oxynitridation, in which NO reacts with the first Si layer on the Si(001)-2×l surface, takes place in a layer-bylayer manner caused by two-dimensional nucleation. However, further oxynitridation for the second Si layer proceeds in a three-dimensional manner in which the atomic-scale roughness at the oxynitride/Si interface increases. In addition, under our oxynitridation conditions, N is incorporated as N ≡ Si3, even though the oxynitride is ultrathin.
Layer-by-layer oxidation of Si(111) and (001) surfaces has been studied by using scanning reflection electron microscopy (SREM). We found that SREM images reveal interfacial structures of the SiO2/Si system. Our results showed that the initial step structure of Si substrates was preserved at SiO2/Si interfaces and that interfacial steps did not move laterally during oxidation. We also observed a periodic reversal of terrace contrast in SREM images during the initial oxidation of Si(001) surfaces. These results indicate layer-by-layer oxidation of Si surfaces, which is promoted by the nucleation of nanometer-scale oxide islands at SiO2/Si interfaces. In addition, we investigated the kinetics of initial layer-by-layer oxidation of Si(001) surfaces. We found that a barrierless oxidation of the first subsurface layer, as well as oxygen chemisorption onto the top layer, occur at room temperature. The energy barrier of the second-layer oxidation was found to be 0.3 eV. The initial oxidation kinetics are discussed based on first-principles calculations. Moreover, we confirmed that the layer-by-layer oxidation of Si surfaces holds true for conventional furnace oxidation.
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