Nitrogen implantation is used to retard gate oxide growth thereby making it particularly usefulfor dual- VT and System On A chip technologies. This paper discusses the diffusion behavior and the concomitant defect evolution at high doses of implanted nitrogen in silicon. This paper shows that as the nitrogen implant dose is increased, the extent of nitrogen diffusion reduces. This paper also reports based onTEM studies, that upon annealing at 750°C, 5 × 10014 N2+/cm2, 40 keV implant produces Type I extended defects. However, 2 × 1015 N2+/cm2, 40 keV implant, produces a continuous amorphous layer to a depth ofabout 800 to 900 Å from the surface. In addition, upon annealing at 750°C, the 2 × 1015 N2+/cm2, 40 keV implant produces Type V or solid solubility defects in addition to End of Range or Type II defects.