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Effect of small dose gamma-irradiation on electrical characteristics of AlGaN/GaN high electron mobility transistors has been investigated. Decreasing of the leakage current and its noise has been registered after dose of 1×106 Rad. As-grown heterostructures used in further for the device fabrication have been examined after the same radiation treatment. The small dose radiation results are explained within a model that takes into account relaxation of elastic strains and structural-impurity ordering occurring in the barrier layer under irradiation.
In this work we present steady-state characteristics and low-frequency noise spectra of AlGaN/GaN based high electron mobility transistors (HEMTs) exposed to gamma ray radiation. The devices with a variety of gate length (150-350 nm) and width (100-400 νm) were irradiated by 60Co gamma rays with doses in the range of 104-109 Rad and flux of 102 Rad/s. Dose dependencies of basic operating parameters of the transistors, such as saturation current (Isat), transconductance (gm), channel conductance (gc), and threshold voltage (VT) are analysed. Our study show that visible changes of above mentioned parameters are observed under relatively small doses (105 Rad) and strongly depend on the HEMT's topology. The transconductance decreases and threshold voltage becomes more negative for all devices while deviation of these parameters from its initial values does not exceed 20% at highest irradiation dose. At the same time variation of the channel conductance as well as saturation current depends to a high extent on the gate voltage (Vg). At |Vg| < |Vcr|, both Isat and gc show a reversal proportional to the cumulative dosage of radiation. However, at |Vg| > |Vcr|, drain saturation current and channel conductance increase with the cumulative dosage of radiation. The effect is more pronounced in short-length-gate devices.
AlGaN/GaN is a promising system for high power electron devices. Quality of ohmic contacts is a critical parameter in determining the performance of the device. Although we have achieved a transfer resistance (Rc) of 0.35Δmm and ρc of 9.5×10−7 Δcm−2 the morphology and edge acuity of the contacts are poor. The standard ohmic contact recipes consist of a combination of Titanium and Aluminum with Nickel and/or Gold. This is annealed at 800°C-950°C [1-5]. In this work we study ohmic contacts on unintentionally doped Al0.3Ga0.7N/GaN system. We look at ratios of Ti/Al from 0 to 2 to determine which is the optimum ratio in terms of surface morphology and electrical characteristics. From our studies we conclude that morphology of a Ti/Al contact is good over a ratio of 0.3 and the contact resistance is minimized at a Ti/Al of 0.6. The ohmic contacts are improved electrically if a layer of gold is added on top. The best electrical contacts however were obtained with a four layer recipe of Ti/Al/Ti/Au, which gave contact resistance (Rc) around 0.45Δmm, but the morphology of the contacts was poor.
Two dimensional hole and electron gases in wurtzite GaN/AlxGa1-xN/GaN heterostructures are induced by strong polarization induced effects. The sheet carrier concentration and the confinement of the two dimensional carrier gases located close to one of the AlGaN/GaN interfaces are sensitive to a high number of different physical properties such as polarity, alloy composition, strain, thickness and doping. We have investigated the structural quality, the carrier concentration profiles and electrical transport properties by a combination of high resolution x- ray diffraction, Hall effect and C-V profiling measurements. The investigated heterostructures with N- and Ga-face polarity were grown by metalorganic vapor phase or plasma induced molecular beam epitaxy covering a broad range of alloy compositions and barrier thickness. By comparison of theoretical and experimental results we demonstrate that the formation of two dimensional hole and electron gases in GaN/AlGaN/GaN heterostructures both rely on the difference of the polarization between the AlGaN and the GaN layer. In addition the role of polarity on the carrier accumulation at different interfaces in n- and p-doped heterostructures will be discussed in detail
In this study thin AlxGa1−xN nucleation layers on sapphire were patterned and overgrown by plasma-induced molecular beam epitaxy (PIMBE) and metalorganic chemical vapor deposition (MOCVD) to obtain adjacent regions of GaN and AlGaN/GaN heterostructures with different polarities. The role of polarity on the structural and electrical properties of epitaxial layers and AlGaN/GaN heterostructures was investigated for samples grown on patterned AlN or GaN nucleation layers. Epitaxial GaN and AlGaN/GaN heterostructures grown on Al-face AlN or N- face GaN nucleation layers were found to be Ga-face or N-face, respectively, independent of the technique used for the overgrowth.
Cross-sectional transmission electron microscopy (XTEM) has been used to study the defect structure and intermixing of ion-implanted and annealed AlxGa1−xAs/GaAs superlattices. The results show clearly that the layer intermixing depends on mass and energy of the implanted species and the annealing conditions. The temperature and duration of annealing determines mainly the amount of residual damage. In addition it was observed that in all cases the point-defects agglomeration was influenced by the strain field present at the layer interfaces; extended defects nucleate preferentially in the GaAs layers.
Cross-sectional Transmission Electron Microscopy, Sputter-Auger spectroscopy, and Raman spectroscopy have been used to study intermixing and residual damage in annealed ion-implanted Al0.3Ga0.7As/GaAs superlattices. Several implant species were studied Nse, Si, Mg, Be). Three different regions can be distinguished in the annealed ionimplanted superlattice samples. The topmost region contains a dense network of stacking faults and microtwins, residual damage from an implantation-amorphized region which has recrystallized during annealing. In the second region, which is relatively defect-free, either total, or at least appreciable intermixing of the GaAs and Al0.3Ga0.7As layers occurs. For fixed annealing conditions, the degree of intermixing varies with the mass of the implanted species. The third region contains many small dislocation loops which form by the agglomeration of point defects during implantation or the subsequent annealing process. Raman spectroscopy is used to compare the degree of intermixing and residual damage between AlGaAs alloys generated by superlattice disordering and uniform “as-grown” alloys of the same composition which have undergone identical implant and anneal treatments.
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