In this study, the influence of an externally applied elastic strain on the electrochemical activity of metal film catalysts during the oxygen reduction reaction (ORR) was examined. A novel three-layer specimen, composed of a 10 nm-thick Pt or Pd surface film on a 20 nm-thick Pd70Zr30 metallic glass film that was first deposited on a polymer substrate was used. The intermediate metallic glass layer is instrumental in allowing the top-layer catalytic film to be elastically deformed to a large elastic strain, (up to 2%), enabling a strain effect to be clearly observed. The results consistently show that an applied compressive strain improves the ORR catalytic activity of the Pd and Pt surface layer, while a tensile strain degrades it. These experimental findings are consistent with the prediction of the d-band model, and provide an opportunity to improve the catalytic response during ORR.

Sn whisker formation was studied in a “bimetal ledge specimen” that consisted of a uniform layer of Sn that was covered by Cu on only half the sample. Whiskers are observed to grow in the Cu-free region of the sample, which is attributed to stress generated by the diffusion of Sn atoms along the network of columnar grain boundaries. The Sn diffusion is driven by the intermetallic growth, but the whisker density extends out much further than any measurable Cu concentration. Whiskers were also observed to grow in the Cu-coated region by punching through the overlayer, leaving a Cu-grain on the tip of the Sn whisker.