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Semiconductors or metal nanoparticles (NPs) using their monolayer bindings with self-assembly chemicals are an attractive topic for device researchers. Electrical performance of such structures can be investigated for a particular application, such as memory device. Currently, Au NPs has been reported to show a substantial potential in the memory applications. In this study, Au NP and gluing layer were fabricated through a new method of monolayer formation of a chemical bonding or gluing.
In this study, a new NPs memory system was fabricated by using organic semiconductor, i.e., pentacene as the active layer, evaporated Au as electrode, SiO2 as the gate insulator layer on silicon wafer. In addition, Au NPs coated with binding chemicals were used as charge storage elements on an APTES (3-amino-propyltriethoxysilane) as a gluing layer. In order to investigate chemical binding of Au NP to the gate insulator layer, GPTMS (3-glycidoxy-propyltrimethoxysilane) were coated on the Au NPs. As a result of that, a layer of gold nanoparticles has been incorporated into a metal-pentacene-insulator-semiconductor (MPIS) structure. The MPIS device with the Au NP exhibited a hysteresis in its capacitance versus voltage analysis. Charge storage in the layer of nanoparticles is thought to be responsible for this effect.
We have studied the growth of undoped and n+ μc-Si:H (:CI) films by Remote Plasma CVD using SiH4/SiH2Cl2/H2/He mixtures. It was found that the μc-Si film can be fabricated by increasing flow rate of SiH2Cl2 and/or H2. The deposited undoped μc-Si film exhibited a maximum crystalline volume fraction of 85 %, obtained from Raman spectroscopy. The n-type μc-Si film, deposited with SiH4/SiH2Cl2/H2/PH3/He mixtures, shows a room temperature conductivity of 2 S/cm, conductivity activation energy of 29.8 meV and optical band gap of-2.0 eV. The optical band gap of n-type μc-S1 deposited using SiH2Cl2 is much higher compared to conventional μc-Si film.
We have studied the growth of microcrystalline silicon (μc-Si) and amorphous silicon (a-Si:H) by layer by layer deposition technique, where the deposition and the radical exposure are done alternatively. He or hydrogen plasma exposure gives rise to the etching effect of both μc-Si and a-Si:H even though the etch rate by He plasma is much smaller. The long exposure of hydrogen radical on a-Si:H gives rise to the formation of μc-Si at low substrate temperature (Ts), whereas the hydrogen content decreases at high Ts. The growth mechanism of the crystallite is proposed on the basis of experimental results.
We have studied the depositions of amorphous silicon, silicon carbon alloy, doped microcrystalline silicon in order to apply these films as the component materials for the p-i-n and double stacked solar cells. We have obtained low band gap a-Si:H by decreasing the deposition rate under the proper preparation conditions and highly conductive, thin microcrystalline Si and SiC layers. We have developed a stable a-Si/a-Si double stacked solar cell with a conversion efficiency of ∼ % using narrow band gap a-Si:H as a i-layer of bottom cell.The performance of this cell does not degrade until 100 hrs illumination under 350 mW/cm2.
We have studied the effects of interface and surface on the performance of hydrogenated amorphous silicon(a-Si:H) thin film transistors. The effects of rf power, the buffer layer between the gate insulator and a-Si:H, and the surface oxidation on the performance on the a-Si:H TFTs have been investigated. By introducing suitable buffer layer, we can increase the mobility up to 2.1 cm2/Vs. The surface oxidation gives rise to the electron accumulation near the surface.
We have studied the effect of RF power on the properties of Si thin films prepared by a conventional plasma and remote plasma(RP)- CVD. The structure of the Si film changes from amorphous to crystalline with increasing RF power in RP-CVD. However, the structure of Si film deposited by P-CVD remains amorphous with increasing RF power. The relaxation of Si atoms by means of chemical annealing of He metastable atoms gives rise to the formation of macrocrystalline structure at the high RF powers.
We studied the growth of polycrystalline silicon by using remote plasma chemical vapour deposition technique. The effects of RF power and the substrate temperature on the structural properties have been investigated. With increasing the RF power, the crystalline volume fraction and the grain size increase up to 100W, but decrease for the further increase in power level. We obtained the poly-Si with the crystalline volume fraction of about 74 at.% at the substrate temperature of 330°C.
We have studied the improvement of the quality of undoped a-Si:H deposited by remote-plasma chemical vapour deposition. The effects of reactant gas concentration, rf power, substrate bias voltage on the electrical and optical properties have been investigated. Some hydrogen dilution of si lane improves the photoeletric property and a high rf power gives rise to the defect creation due to the ion bombardment on the growing surface. The positive substrate bias improves the quality of undoped a-Si:H.
Thermal equilibration processes in diode structures of doped hydrogenated amorphous silicon (a-Si:H) have been studied. The fast cooling from above the thermal equilibrium temperature (TE) results in an increase in dark reverse current as well as in forward current. The reverse leakage currrent and the diode quality factor increase with quenching temperature at above TE. It is concluded that the dangling bond density increases upon fast cooling from above TE, even though the amount of the increase is small compared with that for the active dopants. On the other hand, the drift mobility changes little after fast cooling. We propose a new model to explain the experimental results.
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