We investigated the polishing rate and selectivity of nitrogen-doped Ge2Sb2Te5 (NGST) to SiO2 film for different abrasive materials (colloidal silica, fumed silica, and ceria abrasives). They both were strongly dependant on abrasive material properties. The polishing rate of nitrogen-doped NGST decreased in the order ceria, fumed silica, and colloidal silica abrasives, which was determined by abrasive material properties, such as abrasive hardness, crystal structure, and primary and secondary abrasive sizes. In addition, the polishing rate slope of NGST film was not significantly different for different abrasive materials, indicating that the polishing of NGST film is mechanical dominant polishing. In contrast, the polishing rate slope of SiO2 film decreased in the order ceria, fumed silica, and colloidal silica abrasives, indicating that the polishing of SiO2 film is chemical dominant polishing. Furthermore, the difference in polishing rate slopes between NGST and SiO2 film gave a polishing rate selectivity of NGST to SiO2 film higher than 100:1 with colloidal silica abrasive.

Recently, non-volatile polymer memories have been researched as a next generation of non-volatile memory because of its simple structure and easy fabrication process. We found that two types of non-volatile polymer memory have different I-V behavior. First Polymer non-volatile memory with metal / oxide / polymer / metal structure But Polymer non-volatile memory embedded Au Nano-crystal shows different I-V behavior. Polymer non-volatile memory shows NDR(Negative Differential Resistance) Region after threshold voltage and low to high current path at increasing positive and negative bias. We can observe NDR(Negative Differential Resistance) Region on Polymer non-volatile memory embedded Au Nano crystal. We fabricated devices three different type to confirm difference Polymer non-volatile memory with metal / polymer / metal structure, metal / oxide / polymer / metal structure and Au nano-crystal embedded Polymer non-volatile memory. First we fabricated Polymer non-volatile memory with metal / PVK(Poly-n-vinyl carbarzole) / metal structure. first type of device shows ohmic I-V behavior. Second type of polymer non-volatile memory has oxide layer between metal and polymer layer. Oxide layer made by O2 plasma treatment(100W RF power, 100SCCM O2 gas flow) after metal layer deposited. Second type of device has same structure as first device except oxide layer. Second type of device shows I-V behavior similar to Resistive Memory. Resistive non-volatile memory shows low to high current path at increasing positive bias and high to low current path at increasing negative bias. I-V behaviors of second device due to effect of oxide layer between metal and polymer layer. Third type of polymer non-volatile memory we embed Au nano-crystal layer in polymer layer. Au nano-crystal layer embedded by curing process. We deposit 5nm Au layer after spin coated PVK(Poly-n-vinyl carbarzole) layer and curing at 300¡É. We can observe NDR(Negative Differential Resistance) Region and different I-V behaviors with other type of device. Finally we fabricated polymer non-volatile memory embedded au nano-crystal by dispersion method to confirm effect of au nano-crystal. We report difference I-V behaviors polymer non-volatile memory with metal / polymer / metal structure and polymer non-volatile memory embedded au nano-crystals

Many researchers have investigated organic nonvolatile memory devices as one of candidates device for next generation nonvolatile memory because of their low-cost, flexible and simple fabrication. The memory phenomenon in these devices is based on the electrical bistability of the material, which has two resistance states. We report memory effect in organic molecules based on electrical bistability of the materials and the bistable phenomenon was observed in poly(N-vinylcarbazole) (PVK) layer, containing a high density of Au nanocrystals and sandwiched between Al electrodes. The device was fabricated on cleaned SiO2. First, Al for the bottom electrode was deposited on SiO2 substrate by thermal evaporation in a vacuum chamber (pressure ∼10−6 torr). The PVK was dissolved with chloroform, spin-coated on the Al electrode, and baked at 120¡ÆC for 2 min to evaporate the solvent away. Subsequently, a 5-nm-thick Au film was deposited on the PVK. Additional PVK was then spin-coated on the Au film and baked. Next, the device was cured at 300¡É for 2 h in air to produce the Au nano-crystals. This device showed good nonvolatile memory characteristics. It was confirmed that it shows several region of current levels, (ION, IOFF, IINTER). When the voltage increased from zero in the OFF state (low conductivity state), the current increased rapidly at the threshold voltage (Vth), and presented a regime of negative differential resistance (NDR) after writing. Moreover ON and OFF states could be set at voltages at Vprogram (or Vp) and Verase (or Ve), respectively, and could be read at 1 V. After the device was programmed by sweeping the voltage from 0 to Vp, the current followed the high conductivity state and stayed in the ON state. And the device was programmed by sweeping the voltage from 0 to Ve, the current followed the low conductivity state and stayed in the OFF state. Furthermore, they exhibited seven different reversible current paths (intermediate states) capable for approving electron charge or discharge on surface of Au nanocrystals by sweeping the voltage from 0 to VNDR. Our results demonstrate that the fundamental parameters of the device were stable; the values of Vth, Vp, and Ve were ∼2.8, ∼4, and ∼8 V, respectively. In particular, this device exhibited excellent nonvolatile memory behavior, with bistability (ION/IOFF) of >1×102 and an intermediate state for multi-bit operation. We suggest that the current conduction mechanism clearly follow space-charge-limited(SCLC) for low conductivity state, thermionic field emission for electron charge(writing) or discharge(erasing), and F-N tunneling after erasing.

The effect of changes in poly(acrylic acid) (PAA) conformation on removal of Si3N4 film was investigated. PAA was used as a passivation agent by adsorption on an Si3N4 film in shallow-trench isolation chemical–mechanical planarization (STI CMP). Adsorption behavior of PAA on the Si3N4 film and the conformation transition were determined by adsorption isotherms and force measurements using atomic force microscopy (AFM) as a function of ionic strength. AFM results revealed that, as ionic strength increases, the repulsive force between the negatively charged carboxylate groups along the backbone of PAA is reduced due to counterion screening and to the changes of PAA conformation from a stretched to a coiled configuration. At high ionic strength, the coiled conformation of PAA formed a dense passivation layer on the Si3N4 film, which led to suppression of the removal rate of Si3N4 film from 72 to 61 Å/min in the STI CMP process.

Organic devices fabricated with a top metal layer/conductive organic layer/middle metal layer/conductive organic layer/bottom metal layer structure have been reported to demonstrate nonvolatile memory behavior such as an after writing (Ion)/after erasing (Ioff) performance of > 1 × 101 and a response time of ∼10 ns, when the organic conductive layers were AIDCN (2-amino-4, 5-imidazoledicarbonitrile), Alq3 (Aluminum tris(8-hydroxyquinoline)), or α-NPD. We fabricated an organic nonvolatile memory device with a structure of α-NPD/Al nanocrystals surrounded by Al2O3/α-NPD/Al, where α-NPD was N,N'-bis(1-naphthyl)-1,1'biphenyl4-4''diamine. A layer of Al nanocrystals, confirmed by a 1.25-MV high voltage transmission-electron-microscope, was uniformly produced between the α-NPD layers by Al layer evaporation at 1.0 Å/sec on the α-NPD followed by O2 plasma oxidation. We confirmed a conduction bistability of ∼102 and a threshold voltage for a set state of 3 V. Al nanocrystals surrounded by amorphous Al2O3 were formed in the α-NPD. They presented seven different reversible current paths for an electron charge or discharge on the nanocrystals. The current slightly increased with an applied bias from 0 V to Vth (a high resistance state (Ioff)), abruptly increased with an applied bias from Vth to Vp, decreased with an increasing applied bias from Vp to Ve (a negative differential resistance (NDR) region), and slightly increased with an applied bias above Ve. After sweeping the first applied voltage from 0 to 10 V (erase), a second applied bias was swept from 0 to Vp (program), where the current followed a high resistance state (Ioff). Next, a third applied bias was swept from 0 to Vp again, where the current followed a low resistance state (Ion). Surprisingly, the ratio of Ion to Ioff was ∼1×102, which is enough current difference to be nonvolatile memory behavior. These I-V characteristics under a positive applied bias were symmetrically repeated under a negative applied bias. All the current sweeping paths were reproducible and symmetrical for an applied bias polarity. In particular, our device demonstrated multi-level nonvolatile memory behavior. It also revealed the current conduction mechanism for each of its operation regions. We observed that the high resistance and low resistance regions followed space-charge-limited current conduction, the Vth to Vp and VNDR to Ve regions followed precisely thermionic-field-emission current conduction, and the above Ve regions followed space-charge-limited current conduction.

We fabricated organic nonvolatile memory with a device structure of Al/Alq3 (aluminum tris (8-hydroxyquinoline))/Ni nanocrystals surrounded by NiO/Alq3/Al. We obtained the best bistable switching characteristics at a 30-nm Alq3 thickness, 0.1-Å/sec evaporation rate, and 10-nm Ni nanocrystal layer thickness. The electrical behavior of the bistable switching devices was obtained by sweeping the voltage from 0 to 10 V. Our devices showed excellent bistable memory characteristics, such as a Vth of 2 V, Vp of 3 V, Ve of 5 V, and Ion/Ioff ratio of greater than 104. We found that a region of negative differential resistance exists between Vp and Ve.

Recently, organic nonvolatile memory of nonvolatile memories have attracted attention because application as next generation memory devices. In effort for realizing low-molecular organic nonvolatile memory, the dependence of organic thickness on electrical characteristic behavior in low-molecular organic nonvolatile memory was investigated. We developed an low-molecular organic nonvolatile memory fabricated with the device structure of Al/Alq3 (Aluminum tris(8-hydroxyquinoline))/Ni nanocrystals/Alq3/Al. Four different organic thicknesses, i.e., 30, 40, 50, and 100 nm, with fixing middle layer thickness were deposited by using a high vacuum thermal deposition method. The reason we chose Ni for middle metal layer is that Ni has smaller grain boundary which is benefit for scaling down and larger work function (∼5.15 eV) that can make a deep quantum well in energy band diagram, compared with those of Al. We confirmed that, as an organic thickness increases, a current level linearly decreases by an order of magnitude in a log-scale except for the 100 nm sample case. That is, Ion of 30-nm-thick sample was about 1 mA and 50-nm-thick sample was about 10 ¥ìA. The reason why the decrease in the current with increasing an organic thickness can be attributed to that electron transfer occurs less frequently because of the decrease in the hopping frequency. In addition, a 100-nm-thick sample was not shown the electrical characteristic of low-molecular organic nonvolatile memory. Meanwhile, the switching characteristics of our device showed that Vth of 2V, Vp(program) of 4V, Ve(erase) of 7V, and Ion (after programming)/Ioff (after erasing) of ~6x103. In addition, the interesting behavior of those characteristics is that the switching voltages (e.g; Vth, Vp, Ve Ion/Ioff) were not much changed with a varying an organic thickness. Therefore, we can conclude that an organic thickness does not affect significantly to the switching characteristics but current level. In addition, it was confirmed that a 30-nm-thick organic thickness was the best process condition in realizing low-molecular organic nonvolatile memory fabrication process.

The effects of the molecular weight and concentration of poly(acrylic acid) (PAA) with different primary abrasive sizes in ceria slurry on the nitride film loss, removal rate, film surface roughness, and removal selectivity of SiO2-to-Si3N4 films were investigated by performing chemical mechanical polishing (CMP) experiments using blanket and patterned wafers. In the case of the blanket wafers, we found that for a lower PAA molecular weight, the removal selectivity of SiO2-to-Si3N4 films increased more significantly with increasing PAA concentration in slurry containing a larger primary abrasive size. For the patterned wafers, with a higher PAA molecular weight in the ceria slurry suspension, the erosion of the Si3N4 film was less, but the removed amount was also smaller, and the surface roughness became worse after CMP. These results can be qualitatively explained by the layer of PAA adsorbed on the film surface, in terms of electrostatic interaction and rheological behavior.

The influence of the molecular weight of poly(acrylic acid) (PAA) on chemical mechanical planarization (CMP) for shallow trench isolation (STI) was investigated. The adsorption behaviors of PAA as a function of molecular weight on deposited plasma-enhanced tetraethylorthosilicate and chemical vapor deposition Si3N4 films were analyzed by the force measurement using atomic force microscopy (AFM). The AFM results revealed that the affinity of PAA with the nitride film is higher than the affinity with the oxide film, and thus a denser adsorption layer on the nitride film is formed with higher molecular weight of PAA, which leads to higher selectivity in STI CMP. Additionally, to determine the correlation between the dispersion stability of the CeO2 resulting from the presence of PAA with different molecular weight and CMP performance, the colloidal properties of the slurry as a function of the molecular weight of PAA were examined.

Recently, low molecular organic non-volatile memories have been developed as a next generation of non-volatile memory because of nano-meter device-feature size and nano-second access and store-time. We developed a non-volatile memory fabricated with the device structure of Al/ α-NPD/Al nano-crystals surrounded by Al2O3/α-NPD/Al, where α-NPD is N,N'-bis(1-naphthyl)-1,1'biphenyl4-4”diamine. One layer of Al nano-crystals with ∼20 nm-width ∼20 nm length was uniform produced between α-NPD layers, confirmed by 1.2MV high voltage transmission-electron-microscope. This device showed Vth of 3.0 V, Vprogram of 4.3 V, and Verase of 6.3 V. Particularly, this device exhibited an excellent non-volatile memory behavior performing the bi-stability (Iprogrm/Ierase) of >1×102, program/erase cycles of >1×105 and multi-levels. In addition, previous reports about low molecular organic non-volatile memories have showed a bad reproducible memory characteristic. However, this issue was completely solved via isolating Al nano-crystals embedded in α-NPD by O2 plasma oxidation. The uniformity of Vth, Vp, and Ve were 9.91%, 6.94% and 7.92%, respectively. Furthermore, the effect of buffer or barrier layer on non-volatile memory characteristics was investigate to examine the control ability for Vth, Vp, and Ve. The 0.5-nm LiF showed a barrier layer behavior suppressing the bi-stability of non-volatile memory. Otherwise, 15-nm CuPc exhibited a buffer layer behavior enhancing the bi-stability of nonvolatile memory.

A bistable effects of Au nano-crystals embedded in poly(N-vinylcarbazole) (PVK) were observed. Subsequently we investigated dependency of the nonvolatile memory behavior on curing temperature for the Au nano-crystals embedded in the PVK. For the study, in the devices of different curing temperatures we measured current-voltage characteristics for the devices and investigated the formation of the Au nano-crystals using cross sectional transmission electron microscopy (TEM). The nonvolatile memory behavior depends on the curing temperature, which is attributed to the suitable formation of the Au nano-crystal.

A gold and aluminum layer was investigated as an anode for organic light-emitting devices (OLEDs). By pretreating the ultrathin aluminum layer in an oxygen (O2) plasma, the hole injection from the metal anode to the organic layer was greatly enhanced. The fabricated OLEDs demonstrated improved current density and luminance characteristics as compared with other devices using a gold anode and an aluminum layer not treated with an oxygen plasma.

The nanotopography of the surface of silicon wafers has become an important issue in ULSI device manufacturing, as it affects the post–chemical mechanical polishing (post-CMP) uniformity of the thickness deviation of dielectric films. A spectral method is proposed to examine quantitatively how the nanotopography impacts the film thickness deviation during CMP. The nanotopography impact was investigated in terms of its dependence on the characteristics of consumables, such as the polishing pad hardness and the wafer manufacturing method. In addition, the effects of the surfactant and the abrasive size in ceria slurry on nanotopography impact were investigated. It was found that the magnitude of the post-CMP oxide thickness deviation due to nanotopography increased with the surfactant concentration in the case of smaller abrasives but was almost independent of the concentration in the case of larger abrasives. These results demonstrate that the nanotopography impact can be controlled by manipulating the slurry characteristics.

The effects of the electrokinetic behavior of abrasive ceria particles suspended in an aqueous medium and the deposited plasma-enhanced tetraethylorthosilicate (PETEOS) and chemical vapor deposition (CVD) Si3N4 films on chemical mechanical planarization (CMP) for shallow trench isolation were investigated. The colloidal characteristics of ceria slurries, such as their stability and surface potential, in acidic, neutral, and alkaline suspensions were examined to determine the correlation between the colloidal properties of ceria slurry and CMP performance. The surface potentials of the ceria particles and the PETEOS and CVD Si3N4 films in an aqueous suspending medium were dependent on the pH of the suspending medium. The differences in surface charges of ceria particles and the PETEOS and CVD Si3N4 films have a profound effect on the removal rate and oxide-to-nitride selectivity of CMP performance.