5 results
Optimizing Stressor Film Deposition Sequence in Polish Rate Order for Best Planarization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1335 / 2011
- Published online by Cambridge University Press:
- 23 June 2011, mrss11-1335-o03-01
- Print publication:
- 2011
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Amorphous Carbon as a Diffusion Barrier to Copper
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 481
- Print publication:
- 1993
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The Effect of Copper on the Titanium-Silicon Dioxide Rbaction and the Implications for Self-Encapsulatin G. Self-Adhering Metallization Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 260 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 763
- Print publication:
- 1992
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Electrical Contacts to Metastable GexSi1−x Using Pd2Si as a Transport Layer
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- Journal:
- MRS Online Proceedings Library Archive / Volume 281 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 635
- Print publication:
- 1992
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The Effect of Copper on the Titanium-Silicon Dioxide Reaction and the Implications for Self-Encapsulating, Self-Adhering Metallization Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 265 / 1992
- Published online by Cambridge University Press:
- 15 February 2011, 205
- Print publication:
- 1992
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