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The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W1.9
- Print publication:
- 2005
-
- Article
- Export citation
Frictional behavior and particle adhesion of abrasive particles during Cu CMP
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W6.2
- Print publication:
- 2005
-
- Article
- Export citation