8 results
Effects of the microstructure of ZnO seed layer on the ZnO nanowire density
- Journal: Journal of Materials Research / Volume 26 / Issue 10 / 28 May 2011
- Published online by Cambridge University Press: 16 May 2011, pp. 1292-1297
- Print publication: 28 May 2011
-
- Article
- Export citation
-
A study on materials interactions between Mo electrode and InGaZnO active layer in InGaZnO-based thin film transistors
- Journal: Journal of Materials Research / Volume 25 / Issue 2 / February 2010
- Published online by Cambridge University Press: 31 January 2011, pp. 266-271
- Print publication: February 2010
-
- Article
- Export citation
-
Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging
- Journal: Journal of Materials Research / Volume 22 / Issue 10 / October 2007
- Published online by Cambridge University Press: 31 January 2011, pp. 2817-2824
- Print publication: October 2007
-
- Article
- Export citation
-
Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C
- Journal: Journal of Materials Research / Volume 21 / Issue 12 / December 2006
- Published online by Cambridge University Press: 03 March 2011, pp. 3196-3204
- Print publication: December 2006
-
- Article
- Export citation
-
Compositional Effects on the Crystallization Kinetics of Nickel Titanium Thin Films
- Journal: Journal of Materials Research / Volume 20 / Issue 7 / July 2005
- Published online by Cambridge University Press: 01 July 2005, pp. 1728-1734
- Print publication: July 2005
-
- Article
- Export citation
-
The Physical and Electrical Properties of Polycrystalline Si1−xGex as a Gate Electrode Material for ULSI CMOS Structures
- Journal: MRS Online Proceedings Library Archive / Volume 611 / 2000
- Published online by Cambridge University Press: 14 March 2011, C7.1.1
- Print publication: 2000
-
- Article
- Export citation
-
Thermal Stability of The Copper/Tantalum Interfaces In Advanced Microelectronic Metallization
- Journal: Microscopy and Microanalysis / Volume 5 / Issue S2 / August 1999
- Published online by Cambridge University Press: 02 July 2020, pp. 176-177
- Print publication: August 1999
-
- Article
- Export citation
-
Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications
- Journal: MRS Online Proceedings Library Archive / Volume 535 / 1998
- Published online by Cambridge University Press: 10 February 2011, 165
- Print publication: 1998
-
- Article
- Export citation
-