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1 results

BCB Based Packaging for Low Actuation Voltage RF MEMS Devices
David Peyrou, Fabienne PENNEC, Hikmat Achkar, Patrick PONS, Fabio Coccetti, Hervé Aubert, Robert Plana
Journal: MRS Online Proceedings Library Archive / Volume 969 / 2006
Published online by Cambridge University Press: 26 February 2011, 0969-W05-06
Print publication: 2006
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This paper outlines the issues related to RF MEMS packaging and low actuation voltage. It is presented an original approach concerning the modeling of the capacitive contact using multi-physics simulation and advanced characterization. A similar approach is used concerning the packaging development where multi-physic simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.