Interprofessional healthcare team function is critical to the effective delivery of patient care. Team members must possess teamwork competencies, as team function impacts patient, staff, team, and healthcare organizational outcomes. There is evidence that team training is beneficial; however, consensus on the optimal training content, methods, and evaluation is lacking. This manuscript will focus on training content. Team science and training research indicates that an effective team training program must be founded upon teamwork competencies. The Team FIRST framework asserts there are 10 teamwork competencies essential for healthcare providers: recognizing criticality of teamwork, creating a psychologically safe environment, structured communication, closed-loop communication, asking clarifying questions, sharing unique information, optimizing team mental models, mutual trust, mutual performance monitoring, and reflection/debriefing. The Team FIRST framework was conceptualized to instill these evidence-based teamwork competencies in healthcare professionals to improve interprofessional collaboration. This framework is founded in validated team science research and serves future efforts to develop and pilot educational strategies that educate healthcare workers on these competencies.

Non-polar surfaces of HVPE grown GaN were characterized by cathodoluminescence (CL), scanning electron microscopy (SEM), and secondary ion mass spectrometry (SIMS). Both of a- and m-plane GaN were prepared by growing thick GaN along the c-axis, and cutting in transverse orientations. The exposed non-polar surfaces were prepared by mechanical polishing (MP) and chemically mechanical polishing (CMP). Non-uniform luminescent characteristics on a- and m-plane GaN were observed in CL images, indicating a higher concentration of impurities in the area of more luminescence. CL spectra from the bulk samples revealed two peaks: 364 nm and 510 nm, related to band edge and impurity defects respectively. The detection by SIMS confirmed that oxygen was inhomogeneously incorporated during the growth of thick GaN layers. Surface qualities of a- and m-plane GaN were also investigated. The lower optical intensities from a-plane GaN at low acceleration voltages indicated more surface damages were introduced during polish. The optical intensity difference from the two samples was reduced at higher acceleration voltages. Similar CL intensities at low acceleration voltages from a- and m-plane GaN substrates prepared by CMP indicated improved surface qualities.

Homoepitaxial films of 4H-SiC(1120) and 8° off-axis 4H-SiC(0001) have been grown and characterized. The number of domains and the range of full-width half-maxima values of the x-ray rocking curves of the [1120]-oriented wafers were smaller than the analogous values acquired from the (0001) materials. Hydrogen etching of the former surface for 5 and 30 minutes reduced the RMS roughness from 0.52 nm to 0.48 nm and to 0.28 nm, respectively; the RMS roughness for a 30 μm (1120) film was 0.52 nm. Micropipes in the substrates did not thread beyond the film-substrate interface. The separation distance between stacking faults was determined to be 10 μm by transmission electron microscopy. Hall mobilities and carrier concentrations of 12,200 cm2/Vs and 3.1×1014 cm−3 and 800 cm2/Vs and 7.4×1014 cm−3 were measured at 100°K and 300°K, respectively. Photoluminescence indicated high purity. 4H-SiC(1120) PiN devices exhibited average blocking voltages to 1344 V and a minimum average forward voltage drop of 3.94 V.

GaN thin films were grown via metalorganic vapor phase epitaxy on a-plane 4H-SiC substrates on which had been deposited an AlN buffer layer. Atomic force microscopy images revealed that the microstructure of the AlN buffer layer and the subsequently deposited GaN had a highly oriented growth structure where parallel growth features propagated in the [1–1.0] direction. Scanning electron microscopy showed that the interfaces between the substrate, buffer layer, and epi-layer were continuous. Cracking was observed in GaN films having a thickness greater than 800 nm. Plan-view transmission electron microscopy analysis revealed stacking faults and threading dislocations with densities of ∼1.6×106cm-1 and ∼ 3.3×1010cm-1, respectively. X-ray diffraction confirmed that the GaN was deposited epitaxially in the same orientation as the substrate. The average on- and off-axis x-ray full-width half-maxima of the (11.0) and the (10.0) reflections were 948 arcsec and 5448 arcsec, respectively.

Plan-view and cross-section samples of (1120) (a-plane) GaN grown on 4H-SiC substrates with AlN buffer layers were studied by transmission electron microscopy. Samples reveal the presence of a high density of stacking faults formed on the basal plane of hexagonal GaN. These stacking faults, terminated in the growth plane by threading dislocations, nucleate at the AlN/4H-SiC interface and propagate to the GaN layer surface. High resolution electron microscopy shows that the majority of stacking faults are low-energy planar defects of the type I1 and I2. High energy stacking faults (E) are not observed.

Growth of GaN and AlxGa1−xN thin films on 6H-SiC(0001) and Si(111) substrates with low densities of defects using the PENDEO™ process and the characterization of the resulting materials are reported. The application of a mask on the GaN seed structures hinders the vertical propagation of threading dislocations of the seed material during regrowth, but introduces a misregistry in the overgrowing material resulting in low quality crystal growth. This misregistry has been eliminated due to advanced processing and the exclusion of the masking layer. The new generation of samples do not show any misregistry, as shown by transmission electron microscopy.

Growth of GaN and AlxGa1−xN thin films on 6H-SiC(0001) and Si(111) substrates with low densities of defects using the PENDEO™ process and the characterization of the resulting materials are reported. The application of a mask on the GaN seed structures hinders the vertical propagation of threading dislocations of the seed material during regrowth, but introduces a misregistry in the overgrowing material resulting in low quality crystal growth. This misregistry has been eliminated due to advanced processing and the exclusion of the masking layer. The new generation of samples do not show any misregistry, as shown by transmission electron microscopy.