In this work, hydrophobic mesostructured organosilica thin films, exhibiting isolated mesopores (~ 7 nm), have been successfully deposited by spin-coating using different polystyrene-block-polyethylene oxide copolymers (PS-b-PEO) as structure-directing agents and methyltriethoxysilane (MTES) as organosilica precursor. Different ordered mesostructures (Face Centered Cubic, 2D or 3D Hexagonal and Body Centered Cubic) can be achieved by controlling different synthesis parameters. X-Ray Diffraction (XRD) and Grazing Incidence Small Angle X-Ray Scattering (GISAXS) techniques were used to investigate the mesostructure evolution through thermal and UV treatments. Swelling and shrinkage were evidenced by in-situ XRD and X-Ray Reflectivity measurements during the thermal removal of the meso-templates. Infrared spectroscopy and 29Si NMR were additionally used to investigate the microstructure evolution. The film porosity was estimated thanks to Ellipsometry Porosimetry (EP). Correlation between mechanical properties through nanoindentation measurements and the mesostructure ordering is discussed as well as assessments of the dielectric constant k by mercury contact probe.

In this paper, fabrication of nanocomposite thin films with introduction of fullerene (C60) molecules in PolyMethyl MethAcrylate resist (PMMA) was investigated from a material and electrical point of view. The effective inclusion of C60 molecules in the samples was characterized by using UV-vis and Tof-SIMS instruments. The modified resist PMMA:C60 was also studied with Thermal analysis (TGA, DSC) where modification of physical properties is reported. Films were included in MIS and MIM devices and results on non volatile trapping of C60 doped PMMA are presented. Moreover, e-beam exposure tests showed that PMMA:C60 active layers for memory devices, were scalable in size.